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Sylvain Pharand
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Quebec, CA
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Patents Grants
last 30 patents
Information
Patent Grant
Direct attachment of capacitors to flip chip dies
Patent number
11,404,365
Issue date
Aug 2, 2022
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Buried via in a circuit board
Patent number
11,310,921
Issue date
Apr 19, 2022
International Business Machines Corporation
Kyle Indukummar Giesen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Photonics package with face-to-face bonding
Patent number
11,209,598
Issue date
Dec 28, 2021
International Business Machines Corporation
Barnim Alexander Janta-Polczynski
G02 - OPTICS
Information
Patent Grant
Stacked capacitors for use in integrated circuit modules and the like
Patent number
11,004,614
Issue date
May 11, 2021
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
All intermetallic compound with stand off feature and method to make
Patent number
9,793,232
Issue date
Oct 17, 2017
International Business Machines Corporation
Charles L. Arvin
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Joining a chip to a substrate with solder alloys having different r...
Patent number
9,111,793
Issue date
Aug 18, 2015
International Business Machines Corporation
Sylvain Pharand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming coreless flip chip ball grid array (FCBGA) subst...
Patent number
8,841,209
Issue date
Sep 23, 2014
International Business Machines Corporation
Sylvie Allard
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for determining the impact of layer thicknesses on laminate...
Patent number
7,482,180
Issue date
Jan 27, 2009
International Business Machines Corporation
Julien Sylvestre
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTICOMPONENT MODULE DESIGN AND FABRICATION
Publication number
20220308564
Publication date
Sep 29, 2022
International Business Machines Corporation
Kirk D. Peterson
G05 - CONTROLLING REGULATING
Information
Patent Application
BURIED VIA IN A CIRCUIT BOARD
Publication number
20210127502
Publication date
Apr 29, 2021
International Business Machines Corporation
Kyle Indukummar Giesen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES
Publication number
20200357737
Publication date
Nov 12, 2020
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONICS PACKAGE WITH FACE-TO-FACE BONDING
Publication number
20200279840
Publication date
Sep 3, 2020
International Business Machines Corporation
BARNIM ALEXANDER JANTA-POLCZYNSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CAPACITORS FOR USE IN INTEGRATED CIRCUIT MODULES AND THE LIKE
Publication number
20200185156
Publication date
Jun 11, 2020
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINING A CHIP TO A SUBSTRATE WITH SOLDER ALLOYS HAVING DIFFERENT R...
Publication number
20150243625
Publication date
Aug 27, 2015
International Business Machines Corporation
Sylvain Pharand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINING A CHIP TO A SUBSTRATE WITH TWO OR MORE DIFFERENT SOLDER ALLOYS
Publication number
20150061158
Publication date
Mar 5, 2015
International Business Machines Corporation
Sylvain Pharand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING CORELESS FLIP CHIP BALL GRID ARRAY (FCBGA) SUBST...
Publication number
20130043060
Publication date
Feb 21, 2013
International Business Machines Corporation
Sylvie Allard
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR