Sylvester Ankamah-Kusi

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH PATCH ANTENNA IN PACKAGING SUBSTRATE
- Publication number 20240313404
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT MODULE
- Publication number 20240297112
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL S...
- Publication number 20240213185
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aditya Nitin Jogalekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH INTEGRATED...
- Publication number 20240105647
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES
- Publication number 20240071959
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES
- Publication number 20240063118
- Publication date Feb 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- William Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION
- Publication number 20240021971
- Publication date Jan 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aditya Nitin Jogalekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ANTENNAS IN PACKAGES
- Publication number 20240021973
- Publication date Jan 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Harshpreet Singh Phull BAKSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT
- Publication number 20230378146
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL SLOTTED WAVEGUIDE ANTENNA
- Publication number 20230352850
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PACKAGE SUBSTRATE WITH IMPROVED CURRENT DENSITY DISTRIBU...
- Publication number 20230352314
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20230055211
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING PROJECTIONS
- Publication number 20200411416
- Publication date Dec 31, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS

Sylvester Ankamah-Kusi

Person

Patents Grantslast 30 patents

Electronic device multilevel package substrate for improved electro...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH PATCH ANTENNA IN PACKAGING SUBSTRATE

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

PASSIVE COMPONENT MODULE

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL S...

ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH INTEGRATED...

MARCHAND BALUNS IN CORELESS PACKAGE SUBSTRATES

BACK END OF LINE STRUCTURE FOR IMPROVED CURRENT DENSITY IN HR DEVICES

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION

PATCH ANTENNAS IN PACKAGES

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL SLOTTED WAVEGUIDE ANTENNA

MULTILAYER PACKAGE SUBSTRATE WITH IMPROVED CURRENT DENSITY DISTRIBU...

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING PROJECTIONS