Sylvia Lo

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Through silicon via with embedded barrier pad
- Patent number 8,980,741
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via with embedded barrier pad
- Patent number 8,772,945
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Through Silicon Via with Embedded Barrier Pad
- Publication number 20140287581
- Publication date Sep 25, 2014
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via with Embedded Barrier Pad
- Publication number 20130285244
- Publication date Oct 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS