Syougo KIKUCHI

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, resin cured product obtained from adhesive co...
- Patent number 10,358,580
- Issue date Jul 23, 2019
- Hitachi Chemical Company, Ltd.
- Aya Ikeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition, method for manufacturing semiconductor device...
- Patent number 9,868,884
- Issue date Jan 16, 2018
- Hitachi Chemical Company, Ltd.
- Aya Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20160340561
- Publication date Nov 24, 2016
- Hitachi Chemical Company, Ltd.
- Aya Ikeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE CO...
- Publication number 20160340554
- Publication date Nov 24, 2016
- Aya IKEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...