SyuFong Li

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Taoyuan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20240312857
- Publication date Sep 19, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
- Publication number 20240006352
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- SyuFong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Same
- Publication number 20230045422
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS