Syuichi Kobayashi

Person

Fukushima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for double-side polishing wafer
- Patent number 11,298,796
- Issue date Apr 12, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for evaluating polishing pad and method for polishing wafer
- Patent number 10,118,272
- Issue date Nov 6, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing carrier for use in double-side polishing appara...
- Patent number 9,764,443
- Issue date Sep 19, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for a double-side polishing apparatus, double-side polishin...
- Patent number 9,327,382
- Issue date May 3, 2016
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing wafer
- Patent number 9,266,215
- Issue date Feb 23, 2016
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing apparatus
- Patent number 8,834,234
- Issue date Sep 16, 2014
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, manufacturing method thereof and polishing method
- Patent number 8,545,291
- Issue date Oct 1, 2013
- Fujibo Holdings Inc.
- Kohki Itoyama
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 8,454,410
- Issue date Jun 4, 2013
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 8,118,646
- Issue date Feb 21, 2012
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing method for wafer
- Patent number 7,727,053
- Issue date Jun 1, 2010
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Method for evaluating wafer configuration, wafer, and wafer sorting...
- Patent number 6,975,960
- Issue date Dec 13, 2005
- Shin-Etsu Handotai Co., Ltd.
- Makoto Kobayashi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DOUBLE-SIDE POLISHING WAFER
- Publication number 20180272497
- Publication date Sep 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20170069502
- Publication date Mar 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING POLISHING PAD AND METHOD FOR POLISHING WAFER
- Publication number 20160193711
- Publication date Jul 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...
- Publication number 20150375363
- Publication date Dec 31, 2015
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING WAFER
- Publication number 20150147942
- Publication date May 28, 2015
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20120329373
- Publication date Dec 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, MANUFACTURING METHOD THEREOF AND POLISHING METHOD
- Publication number 20120100783
- Publication date Apr 26, 2012
- Shin-Etsu Handotai Co., Ltd.
- Kohki Itoyama
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
- Publication number 20110124271
- Publication date May 26, 2011
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER FOR A DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHIN...
- Publication number 20110104995
- Publication date May 5, 2011
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20100144249
- Publication date Jun 10, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Application
Double-Side Polishing Method for Wafer
- Publication number 20090124175
- Publication date May 14, 2009
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Wafer shape evaluating method, wafer, and wafer selecting method
- Publication number 20040215418
- Publication date Oct 28, 2004
- Makoto Kobayashi
- G01 - MEASURING TESTING

Syuichi Kobayashi

Person

Patents Grantslast 30 patents

Method for double-side polishing wafer

Method for evaluating polishing pad and method for polishing wafer

Method of producing carrier for use in double-side polishing appara...

Carrier for a double-side polishing apparatus, double-side polishin...

Method of double-side polishing wafer

Double-side polishing apparatus

Polishing pad, manufacturing method thereof and polishing method

Polishing apparatus

Carrier for double-side polishing apparatus, double-side polishing...

Double-side polishing method for wafer

Method for evaluating wafer configuration, wafer, and wafer sorting...

Patents Applicationslast 30 patents

METHOD FOR DOUBLE-SIDE POLISHING WAFER

MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...

METHOD FOR EVALUATING POLISHING PAD AND METHOD FOR POLISHING WAFER

METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...

METHOD OF DOUBLE-SIDE POLISHING WAFER

DOUBLE-SIDE POLISHING APPARATUS

POLISHING PAD, MANUFACTURING METHOD THEREOF AND POLISHING METHOD

CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...

CARRIER FOR A DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHIN...

POLISHING APPARATUS

Double-Side Polishing Method for Wafer

Wafer shape evaluating method, wafer, and wafer selecting method