Syunsuke Hirano

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing package substrate for mounting semiconductor d...
- Patent number 12,119,277
- Issue date Oct 15, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing package substrate for loading semiconductor de...
- Patent number 11,990,349
- Issue date May 21, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate, metal foil-clad laminate, laminate having patterned metal...
- Patent number 11,877,396
- Issue date Jan 16, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing laminate having patterned metal foil, and lami...
- Patent number 11,664,240
- Issue date May 30, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing printed wiring board
- Patent number 11,197,379
- Issue date Dec 7, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki Kawashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing package substrate for mounting a semicondu...
- Patent number 10,727,081
- Issue date Jul 28, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR D...
- Publication number 20220051958
- Publication date Feb 17, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR LOADING SEMICONDUCTOR DE...
- Publication number 20220020602
- Publication date Jan 20, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, METAL FOIL-CLAD LAMINATE, LAMINATE HAVING PATTERNED METAL...
- Publication number 20210204404
- Publication date Jul 1, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING LAMINATE HAVING PATTERNED METAL FOIL, AND LAMI...
- Publication number 20200388506
- Publication date Dec 10, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE-MOUNTING SUBS...
- Publication number 20200043752
- Publication date Feb 6, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20200015363
- Publication date Jan 9, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki KAWASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20190181000
- Publication date Jun 13, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING A SEMICONDU...
- Publication number 20190148169
- Publication date May 16, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD...
- Publication number 20150210832
- Publication date Jul 30, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Keisuke Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE
- Publication number 20150056454
- Publication date Feb 26, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Keisuke Takada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Syunsuke Hirano

Person

Patents Grantslast 30 patents

Method for producing package substrate for mounting semiconductor d...

Method for producing package substrate for loading semiconductor de...

Laminate, metal foil-clad laminate, laminate having patterned metal...

Method for producing laminate having patterned metal foil, and lami...

Supporting substrate, supporting substrate-attached laminate and me...

Method for producing printed wiring board

Method for manufacturing package substrate for mounting a semicondu...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR D...

METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR LOADING SEMICONDUCTOR DE...

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

LAMINATE, METAL FOIL-CLAD LAMINATE, LAMINATE HAVING PATTERNED METAL...

METHOD FOR PRODUCING LAMINATE HAVING PATTERNED METAL FOIL, AND LAMI...

SUPPORT AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE-MOUNTING SUBS...

METHOD FOR PRODUCING PRINTED WIRING BOARD

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING A SEMICONDU...

RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD...

RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE