Syunya KOBUCHI

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Silicon wafer single-side polishing method
- Patent number 11,628,534
- Issue date Apr 18, 2023
- Sumco Corporation
- Toshiharu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor wafer
- Patent number 9,991,110
- Issue date Jun 5, 2018
- Sumco Corporation
- Kazuaki Kozasa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing silicon wafer
- Patent number 9,956,663
- Issue date May 1, 2018
- Sumco Corporation
- Kazuaki Kozasa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SILICON WAFER SINGLE-SIDE POLISHING METHOD
- Publication number 20190030676
- Publication date Jan 31, 2019
- SUMCO CORPORATION
- Toshiharu NAKAJIMA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SILICON WAFER
- Publication number 20170252891
- Publication date Sep 7, 2017
- SUMCO CORPORATION
- Kazuaki KOZASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
- Publication number 20170011903
- Publication date Jan 12, 2017
- SUMCO CORPORATION
- Kazuaki KOZASA
- H01 - BASIC ELECTRIC ELEMENTS