Szu-Chuan Pang

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Chu-Tung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package with metal shielding structure and the manufact...
- Patent number 9,831,197
- Issue date Nov 28, 2017
- Sigurd Microelectronics Corp.
- Tsan-Lien Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPACT SENSOR PACKAGE STRUCTURE
- Publication number 20120025211
- Publication date Feb 2, 2012
- SIGURD MICROELECTRONICS CORP.
- TSAN-LIEN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-leaded semiconductor package structure
- Publication number 20090108418
- Publication date Apr 30, 2009
- Wa-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE
- Publication number 20080036053
- Publication date Feb 14, 2008
- Wan-Hua Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY