Szu-Hsien LEE

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for wafer taping
- Patent number 9,761,468
- Issue date Sep 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuh-Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240128231
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20240120295
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Structure with Reduced Peeling and Methods Forming the Same
- Publication number 20240034619
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR WAFER TAPING
- Publication number 20150235879
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuh-Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS