Szu-Ping Tung

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 12,205,824
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,057,445
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for fabricating the same
- Patent number 11,991,930
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co, Ltd.
- Jung-Tang Wu
Information Patent Grant
Thin-film non-uniform stress evaluation
- Patent number 11,804,410
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-De Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-based etch-stop layer
- Patent number 11,769,693
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 11,715,640
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 11,682,624
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer for semiconductor devices
- Patent number 11,651,993
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for fabricating the same
- Patent number 11,515,474
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer for semiconductor devices
- Patent number 11,322,396
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-based etch-stop layer
- Patent number 11,004,734
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 11,004,793
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method for semiconductor devices and structures resultin...
- Patent number 10,867,794
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 10,862,026
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer for semiconductor devices
- Patent number 10,685,873
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure, MRAM device using the via structure and method for f...
- Patent number 10,535,816
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-based etch-stop layer
- Patent number 10,468,297
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 10,340,223
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming same
- Patent number 10,103,099
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 9,917,058
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping process and processing platform thereof
- Patent number 9,873,944
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned repairing process for barrier layer
- Patent number 9,640,428
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrated circuit patterning
- Patent number 9,589,800
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of forming same
- Patent number 9,576,892
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming interconnect structure
- Patent number 9,543,198
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective repairing process for barrier layer
- Patent number 9,514,928
- Issue date Dec 6, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 9,496,169
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping process and processing platform thereof
- Patent number 9,487,864
- Issue date Nov 8, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned repairing process for barrier layer
- Patent number 9,324,606
- Issue date Apr 26, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022911
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240355813
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...
- Publication number 20230377897
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20230275025
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION FOR PATTERNING PROCESS
- Publication number 20230178379
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ssu-Yu Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230073308
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20230037025
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM NON-UNIFORM STRESS EVALUATION
- Publication number 20220359313
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Stop Layer for Semiconductor Devices
- Publication number 20220254680
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...
- Publication number 20220102150
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MATERIAL INCLUDING CARBON-CONTAINING LAYER AND METHOD FO...
- Publication number 20220102200
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Based Etch-Stop Layer
- Publication number 20210280460
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20210265272
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210119120
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM NON-UNIFORM STRESS EVALUATION
- Publication number 20210066139
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Method for Semiconductor Devices and Structures Resultin...
- Publication number 20200312662
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Stop Layer for Semiconductor Devices
- Publication number 20200279770
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20200152864
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Based Etch-Stop Layer
- Publication number 20200066581
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Based Etch-Stop Layer
- Publication number 20190333807
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20190326220
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE, MRAM DEVICE USING THE VIA STRUCTURE AND METHOD FOR F...
- Publication number 20190157548
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Stop Layer for Semiconductor Devices
- Publication number 20180350666
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20180204801
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Stop Layer for Semiconductor Devices
- Publication number 20180005876
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming Same
- Publication number 20170162502
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20170062341
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Capping Process And Processing Platform Thereof
- Publication number 20170044668
- Publication date Feb 16, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Chi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20160240428
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS

Szu-Ping Tung

Person

Patents Grantslast 30 patents

Patterning material including silicon-containing layer and method f...

Method of forming an interconnect structure having an air gap and s...

Method of manufacturing a semiconductor device and a semiconductor...

Memory device and method for fabricating the same

Thin-film non-uniform stress evaluation

Metal-based etch-stop layer

Patterning material including silicon-containing layer and method f...

Method of forming an interconnect structure having an air gap and s...

Etch stop layer for semiconductor devices

Memory device and method for fabricating the same

Etch stop layer for semiconductor devices

Metal-based etch-stop layer

Method of forming an interconnect structure having an air gap and s...

Patterning method for semiconductor devices and structures resultin...

Memory device

Etch stop layer for semiconductor devices

Via structure, MRAM device using the via structure and method for f...

Metal-based etch-stop layer

Method of forming an interconnect structure having an air gap and s...

Semiconductor devices and methods of forming same

Method of forming an interconnect structure having an air gap and s...

Metal capping process and processing platform thereof

Self-aligned repairing process for barrier layer

Method for integrated circuit patterning

Semiconductor devices and methods of forming same

Structure and method for forming interconnect structure

Selective repairing process for barrier layer

Method of forming an interconnect structure having an air gap and s...

Metal capping process and processing platform thereof

Self-aligned repairing process for barrier layer

Patents Applicationslast 30 patents

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...

Method of Forming an Interconnect Structure Having an Air Gap and S...

FILM DEPOSITION FOR PATTERNING PROCESS

MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

THIN-FILM NON-UNIFORM STRESS EVALUATION

Etch Stop Layer for Semiconductor Devices

PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...

PATTERNING MATERIAL INCLUDING CARBON-CONTAINING LAYER AND METHOD FO...

Metal-Based Etch-Stop Layer

Method of Forming an Interconnect Structure Having an Air Gap and S...

MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

THIN-FILM NON-UNIFORM STRESS EVALUATION

Patterning Method for Semiconductor Devices and Structures Resultin...

Etch Stop Layer for Semiconductor Devices

MEMORY DEVICE

Metal-Based Etch-Stop Layer

Metal-Based Etch-Stop Layer

Method of Forming an Interconnect Structure Having an Air Gap and S...

VIA STRUCTURE, MRAM DEVICE USING THE VIA STRUCTURE AND METHOD FOR F...

Etch Stop Layer for Semiconductor Devices

Method of Forming an Interconnect Structure Having an Air Gap and S...

Etch Stop Layer for Semiconductor Devices

Semiconductor Devices and Methods of Forming Same

Method of Forming an Interconnect Structure Having an Air Gap and S...

Metal Capping Process And Processing Platform Thereof

Method of Forming an Interconnect Structure Having an Air Gap and S...