Szu Shing Lim

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Die molding for flip chip molded matrix array package using UV cura...
- Patent number 7,465,368
- Issue date Dec 16, 2008
- Intel Corporation
- Szu Shing Lim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Inhibiting underfill flow using nanoparticles
- Patent number 7,317,257
- Issue date Jan 8, 2008
- Intel Corporation
- Chun Hwa See
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURA...
- Publication number 20090025882
- Publication date Jan 29, 2009
- Intel Corporation
- Szu Shing Lim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Inhibiting underfill flow using nanoparticles
- Publication number 20070134937
- Publication date Jun 14, 2007
- Intel Corporation
- Chun Hwa See
- B82 - NANO-TECHNOLOGY