Ta-Fa Lin

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Kaohsiung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE
- Publication number 20090253230
- Publication date Oct 8, 2009
- Yueh-Ming TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20090189295
- Publication date Jul 30, 2009
- Orient Semiconductor Electronics, Ltd.
- Yueh-Ming TUNG
- H01 - BASIC ELECTRIC ELEMENTS