TA-HAO KUO

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thin-film-deposition machine
- Patent number 11,846,022
- Issue date Dec 19, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus for coating on fine powders
- Patent number 11,739,423
- Issue date Aug 29, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shielding mechanism and substrate-processing chamber with the same
- Patent number 11,476,100
- Issue date Oct 18, 2022
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition equipment capable of reducing precursor dep...
- Patent number 11,427,910
- Issue date Aug 30, 2022
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition equipment and process method
- Patent number 11,332,826
- Issue date May 17, 2022
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEPARATION METHOD OF BONDED SUBSTRATES
- Publication number 20240194492
- Publication date Jun 13, 2024
- SKY TECH INC.
- JUNG-HUA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM-DEPOSITION MACHINE
- Publication number 20230212745
- Publication date Jul 6, 2023
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHIELDING MECHANISM AND SUBSTRATE-PROCESSING DEVICE WITH THE SAME
- Publication number 20220282378
- Publication date Sep 8, 2022
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER-HOLDING DEVICE AND THIN-FILM-DEPOSITION EQUIPMENT USING THE SAME
- Publication number 20220270913
- Publication date Aug 25, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION EQUIPMENT AND PROCESS METHOD
- Publication number 20220178022
- Publication date Jun 9, 2022
- Skytech Co., Ltd.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION EQUIPMENT CAPABLE OF REDUCING PRECURSOR DEP...
- Publication number 20220119945
- Publication date Apr 21, 2022
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS FOR COATING ON FINE POWDERS
- Publication number 20220106685
- Publication date Apr 7, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Thin-film-deposition machine

Atomic layer deposition apparatus for coating on fine powders

Shielding mechanism and substrate-processing chamber with the same

Atomic layer deposition equipment capable of reducing precursor dep...

Atomic layer deposition equipment and process method

Patents Applicationslast 30 patents

SEPARATION METHOD OF BONDED SUBSTRATES

THIN-FILM-DEPOSITION MACHINE

SHIELDING MECHANISM AND SUBSTRATE-PROCESSING DEVICE WITH THE SAME

WAFER-HOLDING DEVICE AND THIN-FILM-DEPOSITION EQUIPMENT USING THE SAME

ATOMIC LAYER DEPOSITION EQUIPMENT AND PROCESS METHOD

ATOMIC LAYER DEPOSITION EQUIPMENT CAPABLE OF REDUCING PRECURSOR DEP...

ATOMIC LAYER DEPOSITION APPARATUS FOR COATING ON FINE POWDERS