Ta-wei SUNG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure including inter-layer dielectric
- Patent number 10,748,809
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method therefor
- Patent number 10,177,026
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-wei Sung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Package With Improved Heat Dissipation Efficienc...
- Publication number 20240222339
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240055371
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230378012
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307306
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING INTER-LAYER DIELECTRIC
- Publication number 20190164810
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-wei SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20180151413
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-wei SUNG
- H01 - BASIC ELECTRIC ELEMENTS

Ta-wei SUNG

Person

Patents Grantslast 30 patents

Semiconductor structure including inter-layer dielectric

Semiconductor structure and fabrication method therefor

Patents Applicationslast 30 patents

Integrated Circuit Package With Improved Heat Dissipation Efficienc...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE INCLUDING INTER-LAYER DIELECTRIC

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR