Tad R. Bergstresser

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Shaker Heights, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Copper coated polyimide with metallic protective layer
- Patent number 6,296,949
- Issue date Oct 2, 2001
- GA-TEK Inc.
- Tad Bergstresser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate for multi-layer printed circuit
- Patent number 6,268,070
- Issue date Jul 31, 2001
- Gould Electronics Inc.
- Tad Bergstresser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesiveless flexible laminate and process for making adhesiveless...
- Patent number 6,171,714
- Issue date Jan 9, 2001
- Gould Electronics Inc.
- Nicholas E. Bergkessel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Copper on polymer component having improved adhesion
- Publication number 20030039760
- Publication date Feb 27, 2003
- Gould Electronics Inc.
- Tad R. Bergstresser
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...