Tadaaki Shono

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Zinc-aluminum solder alloy
- Patent number 7,425,765
- Issue date Sep 16, 2008
- Fujitsu Limited
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and soldered bond
- Patent number 6,893,512
- Issue date May 17, 2005
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and electronic device
- Patent number 6,596,094
- Issue date Jul 22, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldered joint
- Patent number 6,428,911
- Issue date Aug 6, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and soldered bond
- Patent number 6,361,626
- Issue date Mar 26, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Zinc-aluminum solder alloy
- Publication number 20060125105
- Publication date Jun 15, 2006
- FUJITSU LIMITED
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder alloy and soldered bond
- Publication number 20030143104
- Publication date Jul 31, 2003
- FUJITSU LIMITED
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder paste and electronic device
- Publication number 20020102432
- Publication date Aug 1, 2002
- FUJITSU LIMITED
- Masayuki Ochiai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Soldering method and soldered joint
- Publication number 20020018844
- Publication date Feb 14, 2002
- FUJITSU LIMITED
- Masayuki Kitajima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC