Tadaharu Ikeda

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor-encapsulating epoxy resin composition, preparation me...
- Patent number 7,910,638
- Issue date Mar 22, 2011
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Naphthalene and or biphenyl skeleton containing epoxy resin composi...
- Patent number 5,827,908
- Issue date Oct 27, 1998
- Shin-Etsu Chemical Co., Ltd.
- Kazuhiro Arai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions with 2-phenyl-...
- Patent number 5,731,370
- Issue date Mar 24, 1998
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...
- Publication number 20230416466
- Publication date Dec 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR RTM, FIBER-REINFORCED...
- Publication number 20230133834
- Publication date May 4, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...
- Publication number 20230140237
- Publication date May 4, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
PHOTOCURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20230040536
- Publication date Feb 9, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A S...
- Publication number 20160251511
- Publication date Sep 1, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...
- Publication number 20090192258
- Publication date Jul 30, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20080255283
- Publication date Oct 16, 2008
- Takayuki Aoki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tadaharu Ikeda

Person

Patents Grantslast 30 patents

Semiconductor-encapsulating epoxy resin composition, preparation me...

Naphthalene and or biphenyl skeleton containing epoxy resin composi...

Semiconductor encapsulating epoxy resin compositions with 2-phenyl-...

Patents Applicationslast 30 patents

CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR RTM, FIBER-REINFORCED...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...

PHOTOCURABLE MALEIMIDE RESIN COMPOSITION

RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A S...

SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...

THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE