Tadaharu Tanaka

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate used for fabrication of thick film circuit
- Patent number 5,096,768
- Issue date Mar 17, 1992
- Mitsubishi Metal Corporation
- Yoshirou Kuromitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate used for fabrication of thick film circuit
- Patent number 5,087,509
- Issue date Feb 11, 1992
- Mitsubishi Metal Corporation
- Yoshirou Kuromitsu
- H01 - BASIC ELECTRIC ELEMENTS