Tadahiko Sakai

Person

Kadoma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Connection structure of circuit member, connection method, and conn...
- Patent number 9,999,123
- Issue date Jun 12, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode joining method, production method of electrode joined str...
- Patent number 9,839,143
- Issue date Dec 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Connecting method of electronic component
- Patent number 9,015,932
- Issue date Apr 28, 2015
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for soldering and soldering process
- Patent number 8,960,526
- Issue date Feb 24, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate backing device and substrate thermocompression-bonding de...
- Patent number 8,851,138
- Issue date Oct 7, 2014
- Panasonic Corporation
- Hiroki Maruo
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic component mounting system and electronic component mount...
- Patent number 8,817,487
- Issue date Aug 26, 2014
- Panasonic Corporation
- Koji Motomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure
- Patent number 8,759,688
- Issue date Jun 24, 2014
- Panasonic Corporation
- Seiichi Yoshinaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in circuit substrate and method of producing the same
- Patent number 8,499,998
- Issue date Aug 6, 2013
- Panasonic Corporation
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting system and electronic component mount...
- Patent number 8,434,665
- Issue date May 7, 2013
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding core wires to electrodes and electronic unit form...
- Patent number 8,367,938
- Issue date Feb 5, 2013
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components joining method and components joining structure
- Patent number 8,188,605
- Issue date May 29, 2012
- Panasonic Corporation
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component soldering structure and electronic component s...
- Patent number 8,148,253
- Issue date Apr 3, 2012
- Panasonic Corporation
- Mitsuru Ozono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste for soldering and soldering method using the same
- Patent number 8,083,121
- Issue date Dec 27, 2011
- Panasonic Corporation
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components mounting adhesive and electronic components m...
- Patent number 8,034,447
- Issue date Oct 11, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 8,025,205
- Issue date Sep 27, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components joining method and components joining structure
- Patent number 8,018,074
- Issue date Sep 13, 2011
- Panasonic Corporation
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 7,966,721
- Issue date Jun 28, 2011
- Panasonic Corporation
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric components connecting method
- Patent number 7,886,432
- Issue date Feb 15, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic parts module
- Patent number 7,845,074
- Issue date Dec 7, 2010
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic parts module
- Patent number 7,841,081
- Issue date Nov 30, 2010
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 7,797,822
- Issue date Sep 21, 2010
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic components
- Patent number 7,793,413
- Issue date Sep 14, 2010
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering electronic component and soldering structure o...
- Patent number 7,632,710
- Issue date Dec 15, 2009
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering electronic component having solder bumps to sub...
- Patent number 7,568,610
- Issue date Aug 4, 2009
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for assembling the same
- Patent number 7,446,423
- Issue date Nov 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method of bump-equipped electronic component and mounting...
- Patent number 7,284,686
- Issue date Oct 23, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takstoshi Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...
- Publication number 20240196545
- Publication date Jun 13, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki YOSHIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE
- Publication number 20240015893
- Publication date Jan 11, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki MANTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE OF CIRCUIT MEMBER, CONNECTION METHOD, AND CONN...
- Publication number 20160316554
- Publication date Oct 27, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD OF MANUFACT...
- Publication number 20150373845
- Publication date Dec 24, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshiyuki WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-MOUNTED STRUCTURE
- Publication number 20150208509
- Publication date Jul 23, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-MOUNTED STRUCTURE, IC CARD AND COF PACKAGE
- Publication number 20150163903
- Publication date Jun 11, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE JOINING METHOD, PRODUCTION METHOD OF ELECTRODE JOINED STR...
- Publication number 20150047185
- Publication date Feb 19, 2015
- PANASONIC CORPORATION
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING METHOD
- Publication number 20120329182
- Publication date Dec 27, 2012
- Teppei Kojio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20120309133
- Publication date Dec 6, 2012
- PANASONIC CORPORATION
- Yoshiyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RECEIVING DEVICE AND SUBSTRATE THERMOCOMPRESSION-BONDING...
- Publication number 20120234496
- Publication date Sep 20, 2012
- Hiroki Maruo
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20120014084
- Publication date Jan 19, 2012
- PANASONIC CORPORATION
- Koji Motomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20120012645
- Publication date Jan 19, 2012
- PANASONIC CORPORATION
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN APPLICATION APPARATUS AND DATA CREATION APPARATUS FOR RESIN A...
- Publication number 20110315321
- Publication date Dec 29, 2011
- PANASONIC CORPORATION
- Seiichi Yoshinaga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE
- Publication number 20110284265
- Publication date Nov 24, 2011
- PANASONIC CORPORATION
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE
- Publication number 20100327044
- Publication date Dec 30, 2010
- PANASONIC CORPORATION
- Tadahiko Sakai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF BONDING CORE WIRES TO ELECTRODES AND ELECTRONIC UNIT FORM...
- Publication number 20100200282
- Publication date Aug 12, 2010
- PANASONIC CORPORATION
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20100089628
- Publication date Apr 15, 2010
- PANASONIC CORPORATION
- Yoshiyuki WADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTING METHOD OF ELECTRONIC COMPONENT
- Publication number 20100018048
- Publication date Jan 28, 2010
- PANASONIC CORPORATION
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100000773
- Publication date Jan 7, 2010
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Yoshinaga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20090288767
- Publication date Nov 26, 2009
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS M...
- Publication number 20090291314
- Publication date Nov 26, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE
- Publication number 20090260229
- Publication date Oct 22, 2009
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE
- Publication number 20090260230
- Publication date Oct 22, 2009
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...
- Publication number 20090233117
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC COMPONENTS CONNECTING METHOD
- Publication number 20090229123
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENTS
- Publication number 20090205203
- Publication date Aug 20, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Tadahiko Sakai

Person

Patents Grantslast 30 patents

Connection structure of circuit member, connection method, and conn...

Electrode joining method, production method of electrode joined str...

Component-mounted structure

Electronic component mounting method

Electronic component-mounted structure, IC card and COF package

Connecting method of electronic component

Flux for soldering and soldering process

Substrate backing device and substrate thermocompression-bonding de...

Electronic component mounting system and electronic component mount...

Electronic component mounting structure

Electronic element unit and reinforcing adhesive agent

Component built-in circuit substrate and method of producing the same

Electronic component mounting system and electronic component mount...

Method of bonding core wires to electrodes and electronic unit form...

Components joining method and components joining structure

Electronic component soldering structure and electronic component s...

Paste for soldering and soldering method using the same

Electronic components mounting adhesive and electronic components m...

Electronic component mounting method

Components joining method and components joining structure

Electronic component mounting method and electronic component mount...

Electric components connecting method

Method for manufacturing electronic parts module

Method for manufacturing electronic parts module

Electronic component mounting method

Method of mounting electronic components

Method for soldering electronic component and soldering structure o...

Method of soldering electronic component having solder bumps to sub...

Semiconductor device and method for assembling the same

Mounting method of bump-equipped electronic component and mounting...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...

MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE

CONNECTION STRUCTURE OF CIRCUIT MEMBER, CONNECTION METHOD, AND CONN...

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD OF MANUFACT...

COMPONENT-MOUNTED STRUCTURE

ELECTRONIC COMPONENT-MOUNTED STRUCTURE, IC CARD AND COF PACKAGE

ELECTRODE JOINING METHOD, PRODUCTION METHOD OF ELECTRODE JOINED STR...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

SEMICONDUCTOR DEVICE MOUNTING METHOD

ELECTRONIC COMPONENT MOUNTING METHOD

SUBSTRATE RECEIVING DEVICE AND SUBSTRATE THERMOCOMPRESSION-BONDING...

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...

ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNT...

RESIN APPLICATION APPARATUS AND DATA CREATION APPARATUS FOR RESIN A...

COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE

METHOD OF BONDING CORE WIRES TO ELECTRODES AND ELECTRONIC UNIT FORM...

COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME

CONNECTING METHOD OF ELECTRONIC COMPONENT

ELECTRONIC COMPONENT MOUNTING STRUCTURE

ELECTRONIC COMPONENT MOUNTING METHOD

ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS M...

METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE

METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE

METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...

ELECTRIC COMPONENTS CONNECTING METHOD

METHOD OF MOUNTING ELECTRONIC COMPONENTS