Tadahiro ISHIZAKA

Person

Yamanashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Hard mask, substrate processing method, and substrate processing ap...
- Patent number 12,060,635
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Tsuyoshi Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,993,841
- Issue date May 28, 2024
- Tokyo Electron Limited
- Masato Araki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming RuSi film and substrate processing system
- Patent number 11,981,992
- Issue date May 14, 2024
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming ruthenium film and apparatus for forming rutheni...
- Patent number 11,702,734
- Issue date Jul 18, 2023
- Tokyo Electron Limited
- Shunji Yamakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium film forming method and substrate processing system
- Patent number 11,680,320
- Issue date Jun 20, 2023
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface processing method and processing system
- Patent number 11,387,112
- Issue date Jul 12, 2022
- Tokyo Electron Limited
- Koichi Takatsuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedding method and processing system
- Patent number 11,152,260
- Issue date Oct 19, 2021
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TiN-based film and TiN-based film forming method
- Patent number 10,927,453
- Issue date Feb 23, 2021
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 10,847,379
- Issue date Nov 24, 2020
- Tokyo Electron Limited
- Masato Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ruthenium wiring
- Patent number 10,629,433
- Issue date Apr 21, 2020
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium wiring and manufacturing method thereof
- Patent number 10,522,467
- Issue date Dec 31, 2019
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective film forming method and method of manufacturing semicondu...
- Patent number 10,490,443
- Issue date Nov 26, 2019
- Tokyo Electron Limited
- Yumiko Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming TiON film
- Patent number 10,483,100
- Issue date Nov 19, 2019
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removal method and processing method
- Patent number 10,460,988
- Issue date Oct 29, 2019
- Tokyo Electron Limited
- Takeshi Itatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lower electrode of DRAM capacitor and manufacturing method thereof
- Patent number 10,199,451
- Issue date Feb 5, 2019
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing Cu wiring
- Patent number 10,096,548
- Issue date Oct 9, 2018
- Tokyo Electron Limited
- Kenji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium metal feature fill for interconnects
- Patent number 10,056,328
- Issue date Aug 21, 2018
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal nanodot formation method, metal nanodot formation apparatus a...
- Patent number 9,932,669
- Issue date Apr 3, 2018
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium film forming method, film forming apparatus, and semicond...
- Patent number 9,779,950
- Issue date Oct 3, 2017
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium metal feature fill for interconnects
- Patent number 9,711,449
- Issue date Jul 18, 2017
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ALD barrier layer and CVD Ru liner for void-free Cu...
- Patent number 9,607,888
- Issue date Mar 28, 2017
- Tokyo Electron Limited
- Kai-Hung Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,576,850
- Issue date Feb 21, 2017
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method, film forming apparatus and recording medium
- Patent number 9,540,733
- Issue date Jan 10, 2017
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring forming method, film forming system, and storage medium
- Patent number 9,425,093
- Issue date Aug 23, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring forming method with Ru liner and Cu alloy fill
- Patent number 9,406,557
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu wiring fabrication method and storage medium
- Patent number 9,406,558
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wiring structure forming method
- Patent number 9,368,418
- Issue date Jun 14, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming copper wiring
- Patent number 9,362,166
- Issue date Jun 7, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming copper wiring
- Patent number 9,313,895
- Issue date Apr 12, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming copper wiring
- Patent number 9,101,067
- Issue date Aug 4, 2015
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240379377
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Method, Apparatus, and System
- Publication number 20240363405
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Masato SAKAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES THAT INCLUDE METAL CAP LAYERS
- Publication number 20240363410
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR EMBEDDING RUTHENIUM IN RECESS FORMED ON SU...
- Publication number 20240360547
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240355615
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240290609
- Publication date Aug 29, 2024
- Tokyo Electron Limited
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATALYST-ENHANCED CHEMICAL VAPOR DEPOSITION
- Publication number 20240213093
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING METHOD AND PROCESSING SYSTEM
- Publication number 20240153818
- Publication date May 9, 2024
- Tokyo Electron Limited
- Masato SAKAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240105445
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Issei TAKEYASU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL OXIDE PRECLEANING PRIOR TO METAL FILLING
- Publication number 20230411142
- Publication date Dec 21, 2023
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DEVICE FOR MANUF...
- Publication number 20230377893
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Shunji YAMAKAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RUTHENIUM FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230227973
- Publication date Jul 20, 2023
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230096191
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Takeshi ITATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM-FORMING METHOD AND FILM-FORMING SYSTEM
- Publication number 20230090881
- Publication date Mar 23, 2023
- TOKYO ELECTRON LIMITED
- Masato ARAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING APPARATUS, FILM FORMING METHOD, AND FILM FORMING SYSTEM
- Publication number 20230093323
- Publication date Mar 23, 2023
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20220301882
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Koichi TAKATSUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR FORMING RUTHENIUM FILM
- Publication number 20220145451
- Publication date May 12, 2022
- TOKYO ELECTRON LIMITED
- Shunji YAMAKAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20210054503
- Publication date Feb 25, 2021
- TOKYO ELECTRON LIMITED
- Masato ARAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING RuSi FILM AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20210017642
- Publication date Jan 21, 2021
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20210010135
- Publication date Jan 14, 2021
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING APPARATUS
- Publication number 20210005493
- Publication date Jan 7, 2021
- TOKYO ELECTRON LIMITED
- Toshiaki FUJISATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD MASK, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING AP...
- Publication number 20200370172
- Publication date Nov 26, 2020
- TOKYO ELECTRON LIMITED
- Tsuyoshi MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20200111675
- Publication date Apr 9, 2020
- TOKYO ELECTRON LIMITED
- Koichi TAKATSUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EMBEDDING METHOD AND PROCESSING SYSTEM
- Publication number 20200098627
- Publication date Mar 26, 2020
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Method and Processing System
- Publication number 20200083098
- Publication date Mar 12, 2020
- TOKYO ELECTRON LIMITED
- Kohichi SATOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etching Method and Etching Apparatus
- Publication number 20190348299
- Publication date Nov 14, 2019
- TOKYO ELECTRON LIMITED
- Masato SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL METHOD AND PROCESSING METHOD
- Publication number 20190198390
- Publication date Jun 27, 2019
- TOKYO ELECTRON LIMITED
- Takeshi ITATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Film Forming Method and Method of Manufacturing Semicondu...
- Publication number 20190096750
- Publication date Mar 28, 2019
- TOKYO ELECTRON LIMITED
- Yumiko KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING RUTHENIUM WIRING
- Publication number 20180254181
- Publication date Sep 6, 2018
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TiN-BASED FILM AND TiN-BASED FILM FORMING METHOD
- Publication number 20180135169
- Publication date May 17, 2018
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tadahiro ISHIZAKA

Person

Patents Grantslast 30 patents

Hard mask, substrate processing method, and substrate processing ap...

Substrate processing method and substrate processing apparatus

Method for forming RuSi film and substrate processing system

Method for forming ruthenium film and apparatus for forming rutheni...

Ruthenium film forming method and substrate processing system

Surface processing method and processing system

Embedding method and processing system

TiN-based film and TiN-based film forming method

Etching method and etching apparatus

Method of manufacturing ruthenium wiring

Ruthenium wiring and manufacturing method thereof

Selective film forming method and method of manufacturing semicondu...

Method for forming TiON film

Removal method and processing method

Lower electrode of DRAM capacitor and manufacturing method thereof

Method of manufacturing Cu wiring

Ruthenium metal feature fill for interconnects

Metal nanodot formation method, metal nanodot formation apparatus a...

Ruthenium film forming method, film forming apparatus, and semicond...

Ruthenium metal feature fill for interconnects

Integration of ALD barrier layer and CVD Ru liner for void-free Cu...

Method for manufacturing semiconductor device

Film forming method, film forming apparatus and recording medium

Copper wiring forming method, film forming system, and storage medium

Copper wiring forming method with Ru liner and Cu alloy fill

Cu wiring fabrication method and storage medium

Copper wiring structure forming method

Method of forming copper wiring

Method for forming copper wiring

Method for forming copper wiring

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Substrate Processing Method, Apparatus, and System

METHODS FOR MAKING SEMICONDUCTOR DEVICES THAT INCLUDE METAL CAP LAYERS

METHOD AND APPARATUS FOR EMBEDDING RUTHENIUM IN RECESS FORMED ON SU...

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

CATALYST-ENHANCED CHEMICAL VAPOR DEPOSITION

EMBEDDING METHOD AND PROCESSING SYSTEM

FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM

METAL OXIDE PRECLEANING PRIOR TO METAL FILLING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DEVICE FOR MANUF...

RUTHENIUM FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

FILM-FORMING METHOD AND FILM-FORMING SYSTEM

FILM FORMING APPARATUS, FILM FORMING METHOD, AND FILM FORMING SYSTEM

SURFACE PROCESSING METHOD AND PROCESSING SYSTEM

METHOD AND APPARATUS FOR FORMING RUTHENIUM FILM

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD FOR FORMING RuSi FILM AND SUBSTRATE PROCESSING SYSTEM

RUTHENIUM FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM

PROCESSING APPARATUS

HARD MASK, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING AP...

SURFACE PROCESSING METHOD AND PROCESSING SYSTEM

EMBEDDING METHOD AND PROCESSING SYSTEM

Embedding Method and Processing System

Etching Method and Etching Apparatus

REMOVAL METHOD AND PROCESSING METHOD

Selective Film Forming Method and Method of Manufacturing Semicondu...

METHOD OF MANUFACTURING RUTHENIUM WIRING

TiN-BASED FILM AND TiN-BASED FILM FORMING METHOD