Tadahiro Okamoto

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 7,915,538
- Issue date Mar 29, 2011
- Fujitsu Semiconductor Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,754,534
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrode pad, a bump provided above...
- Patent number 7,723,847
- Issue date May 25, 2010
- Fujitsu Microelectronics Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 7,355,124
- Issue date Apr 8, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,064,436
- Issue date Jun 20, 2006
- Fujitsu Limited
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,794,273
- Issue date Sep 21, 2004
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices by dividing wafer int...
- Patent number 6,680,241
- Issue date Jan 20, 2004
- Fujitsu Limited
- Tadahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for adhering a tape or sheet to a semiconducto...
- Patent number 4,787,951
- Issue date Nov 29, 1988
- Fujitsu Limited
- Tadahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20080261336
- Publication date Oct 23, 2008
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20080124529
- Publication date May 29, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20080012128
- Publication date Jan 17, 2008
- FUJITSU LIMITED
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20060258045
- Publication date Nov 16, 2006
- FUJITSU LIMITED
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring board and its manufacturing method
- Publication number 20060219429
- Publication date Oct 5, 2006
- FUJITSU LIMITED
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and semiconductor-device manufacturing method
- Publication number 20060214296
- Publication date Sep 28, 2006
- FUJITSU LIMITED
- Tadahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20050140004
- Publication date Jun 30, 2005
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040232549
- Publication date Nov 25, 2004
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030219969
- Publication date Nov 27, 2003
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor devices by dividing wafer int...
- Publication number 20020014661
- Publication date Feb 7, 2002
- FUJITSU LIMITED
- Tadahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Tadahiro Okamoto

Person

Patents Grantslast 30 patents

Multilayer wiring board and its manufacturing method

Semiconductor device and manufacturing method thereof

Semiconductor device having an electrode pad, a bump provided above...

Multilayer wiring board and its manufacturing method

Semiconductor device and method of fabricating the same

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor devices by dividing wafer int...

Method and apparatus for adhering a tape or sheet to a semiconducto...

Patents Applicationslast 30 patents

Semiconductor device and manufacturing method thereof

MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD

Semiconductor device and manufacturing method of the same

Semiconductor device and method of fabricating the same

Multilayer wiring board and its manufacturing method

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device and method of fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor devices by dividing wafer int...