Tadahiro Yokozawa

Person

Ichihara-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming conductor layer, and method for producing multil...
- Patent number 10,149,394
- Issue date Dec 4, 2018
- UBE Industries, Ltd.
- Toru Miura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Production of via hole in a flexible printed circuit board by apply...
- Patent number 7,918,021
- Issue date Apr 5, 2011
- Ube Industries, Ltd.
- Ryuichiro Kogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING CONDUCTOR LAYER, AND METHOD FOR PRODUCING MULTIL...
- Publication number 20160353580
- Publication date Dec 1, 2016
- Ube Industries, Ltd.
- Toru MIURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLYIMIDE FILM AND WIRING BOARD
- Publication number 20150069012
- Publication date Mar 12, 2015
- Ube Industries, Ltd.
- Hiroaki Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/M...
- Publication number 20120308816
- Publication date Dec 6, 2012
- Ube Industries, Ltd.
- Shin-ichiro Kohama
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYIMIDE FILM AND WIRING BOARD
- Publication number 20120288621
- Publication date Nov 15, 2012
- Ube Industries, Ltd.
- Hiroaki Yamaguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POLYIMIDE FILM AND WIRING BOARD
- Publication number 20100252309
- Publication date Oct 7, 2010
- Ube Industries, Ltd.
- Hiroaki Yamaguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20100230142
- Publication date Sep 16, 2010
- UBE INDUSTRIES, LTD.
- Keita Bamba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING METAL WIRING BOARD
- Publication number 20090266589
- Publication date Oct 29, 2009
- UBE INDUSTRIES, LTD.
- Hiroto Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD
- Publication number 20090242411
- Publication date Oct 1, 2009
- Ube Industries, Ltd,
- Tadahiro Yokozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING POLYIMIDE FILM WITH COPPER WIRING
- Publication number 20090211786
- Publication date Aug 27, 2009
- Keita Bamba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION OF VIA HOLE IN FLEXIBLE CIRCUIT PRINTABLE BOARD
- Publication number 20090002953
- Publication date Jan 1, 2009
- Ube Industries, Ltd.
- Ryuichiro KOGURE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polyimide-Metal Laminated Body and Polyimide Circuit Board
- Publication number 20080286538
- Publication date Nov 20, 2008
- UBE INDUSTRIES, LTD.
- Tadahiro Yokozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production of via hole in flexible circuit printable board
- Publication number 20050162835
- Publication date Jul 28, 2005
- Ube Industires, LTD
- Ryuichiro Kogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tadahiro Yokozawa

Person

Patents Grantslast 30 patents

Method for forming conductor layer, and method for producing multil...

Production of via hole in a flexible printed circuit board by apply...

Patents Applicationslast 30 patents

METHOD FOR FORMING CONDUCTOR LAYER, AND METHOD FOR PRODUCING MULTIL...

POLYIMIDE FILM AND WIRING BOARD

POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/M...

POLYIMIDE FILM AND WIRING BOARD

POLYIMIDE FILM AND WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PROCESS FOR PRODUCING METAL WIRING BOARD

POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD

PROCESS FOR PRODUCING POLYIMIDE FILM WITH COPPER WIRING

PRODUCTION OF VIA HOLE IN FLEXIBLE CIRCUIT PRINTABLE BOARD

Polyimide-Metal Laminated Body and Polyimide Circuit Board

Production of via hole in flexible circuit printable board