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Tadahisa Inui

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead frame and semiconductor device
    • Patent number 7,190,055
    • Issue date Mar 13, 2007
    • Matsushita Electric Industrial Co., Ltd.
    • Tadahisa Inui
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    LEAD FRAME, MOLDING DIE, AND MOLDING METHOD
    • Publication number 20080253104
    • Publication date Oct 16, 2008
    • Matsushita Electric Industrial Co., Ltd.
    • Tadahisa Inui
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Lead frame and semiconductor device
    • Publication number 20060220190
    • Publication date Oct 5, 2006
    • Matsushita Electric Industrial Co., Ltd.
    • Tadahisa Inui
    • H01 - BASIC ELECTRIC ELEMENTS