Tadanori Segawa

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring glass substrate for connecting a semiconductor chip to a pri...
- Patent number 7,535,106
- Issue date May 19, 2009
- Renesas Technology Corp.
- Osamu Shiono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,378,333
- Issue date May 27, 2008
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 7,217,992
- Issue date May 15, 2007
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring glass substrate for connecting a semiconductor chip to a pri...
- Patent number 7,183,650
- Issue date Feb 27, 2007
- Renesas Technology Corp.
- Osamu Shiono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,946,723
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 6,888,230
- Issue date May 3, 2005
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having stress cushioning layer
- Patent number 6,621,154
- Issue date Sep 16, 2003
- Hitachi, Ltd.
- Toshiya Satoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor apparatus and a manufacturing method thereof
- Patent number 6,348,741
- Issue date Feb 19, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated semiconductor device
- Patent number 4,965,657
- Issue date Oct 23, 1990
- Hitachi Ltd.
- Masatsugu Ogata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin encapsulated electronic devices
- Patent number 4,933,744
- Issue date Jun 12, 1990
- Hitachi, Ltd.
- Tadanori Segawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wiring glass substrate for connecting a semiconductor chip to a pri...
- Publication number 20070114653
- Publication date May 24, 2007
- Hitachi, Ltd
- Osamu Shiono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050245061
- Publication date Nov 3, 2005
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring glass substrate and method of manufacturing the wiring glass...
- Publication number 20040217455
- Publication date Nov 4, 2004
- Osamu Shiono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Publication number 20040217453
- Publication date Nov 4, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020025655
- Publication date Feb 28, 2002
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS

Tadanori Segawa

Person

Patents Grantslast 30 patents

Wiring glass substrate for connecting a semiconductor chip to a pri...

Semiconductor device and manufacturing method thereof

Semiconductor device, semiconductor wafer, semiconductor module, an...

Wiring glass substrate for connecting a semiconductor chip to a pri...

Semiconductor device and manufacturing method thereof

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor apparatus having stress cushioning layer

Semiconductor apparatus and a manufacturing method thereof

Resin encapsulated semiconductor device

Resin encapsulated electronic devices

Patents Applicationslast 30 patents

Wiring glass substrate for connecting a semiconductor chip to a pri...

Semiconductor device and manufacturing method thereof

Wiring glass substrate and method of manufacturing the wiring glass...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor device and manufacturing method thereof