Tadao Nakaoka

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for high-density ultra-fine printed wiring board
- Patent number 7,175,920
- Issue date Feb 13, 2007
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for chip-on-film use, plasma display panel, or high-fre...
- Patent number 7,172,818
- Issue date Feb 6, 2007
- Furukawa Circuit Foil Co., Ltd.
- Tadao Nakaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultrafine printed wiring boad
- Patent number 7,026,059
- Issue date Apr 11, 2006
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of surface-roughening treatment of copper foil
- Patent number 5,792,333
- Issue date Aug 11, 1998
- Circuit Foil Japan Co., Ltd.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Copper foil for high-density ultra-fine printed wiring board
- Publication number 20050249927
- Publication date Nov 10, 2005
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for chip-on-film use, plasma display panel, or high-fre...
- Publication number 20040043242
- Publication date Mar 4, 2004
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Tadao Nakaoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultrafine printed wiring boad
- Publication number 20040038049
- Publication date Feb 26, 2004
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR