Tadao Tanaka

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Chikuma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Double-side polishing apparatus
- Patent number 9,108,289
- Issue date Aug 18, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and double-side polishing apparatus
- Patent number 8,834,230
- Issue date Sep 16, 2014
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and wafer polishing device
- Patent number 6,764,392
- Issue date Jul 20, 2004
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20150031271
- Publication date Jan 29, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20110130073
- Publication date Jun 2, 2011
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Application
Wafer polishing method and wafer polishing device
- Publication number 20020160693
- Publication date Oct 31, 2002
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING