Tadashi Arai

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple magnetic shield members
- Patent number 9,490,221
- Issue date Nov 8, 2016
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple magnetic shield members
- Patent number 9,466,784
- Issue date Oct 11, 2016
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, light emitting device, and method for manufacturi...
- Patent number 9,257,354
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Hiroshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting element mounting package, light-emitting element pac...
- Patent number 8,941,139
- Issue date Jan 27, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for mounting electronic components, electronic apparatus, a...
- Patent number 8,901,580
- Issue date Dec 2, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, light emitting device and method for manufacturing subst...
- Patent number 8,786,065
- Issue date Jul 22, 2014
- Shinko Electric Industries Co., Ltd.
- Yasuyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, method for manufacturing wiring substrate, and se...
- Patent number 8,686,548
- Issue date Apr 1, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, manufacturing method of the wiring board, and semicon...
- Patent number 8,674,514
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor element, semiconductor element mounted board, and met...
- Patent number 8,610,268
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electronic component incorporation substrate
- Patent number 8,482,117
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and method of manufacturing wi...
- Patent number 8,436,249
- Issue date May 7, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting package
- Patent number 8,143,531
- Issue date Mar 27, 2012
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device manufacturing method and electronic device
- Patent number 8,102,048
- Issue date Jan 24, 2012
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor device embedded substrate
- Patent number 7,985,619
- Issue date Jul 26, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device embedded substrate
- Patent number 7,981,724
- Issue date Jul 19, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,944,039
- Issue date May 17, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device embedded substrate
- Patent number 7,915,078
- Issue date Mar 29, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor d...
- Patent number 7,901,986
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing electronic component integrated substrate
- Patent number 7,827,681
- Issue date Nov 9, 2010
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Kurashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,749,889
- Issue date Jul 6, 2010
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having a built-in chip and external connection terminals...
- Patent number 7,312,536
- Issue date Dec 25, 2007
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a built-in chip type substrate
- Patent number 7,250,329
- Issue date Jul 31, 2007
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160093795
- Publication date Mar 31, 2016
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160093796
- Publication date Mar 31, 2016
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...
- Publication number 20130153945
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, A...
- Publication number 20130126916
- Publication date May 23, 2013
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate, Light Emitting Device and Method for Manufacturing Subst...
- Publication number 20130113015
- Publication date May 9, 2013
- Shinko Electric Industries Co., LTD.
- Yasuyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20130099273
- Publication date Apr 25, 2013
- Shinko Electric Industries Co., LTD.
- Hiroshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WI...
- Publication number 20120103663
- Publication date May 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND MET...
- Publication number 20120074578
- Publication date Mar 29, 2012
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE
- Publication number 20120013021
- Publication date Jan 19, 2012
- Shinko Electric Industries Co., LTD.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...
- Publication number 20110180930
- Publication date Jul 28, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...
- Publication number 20110169133
- Publication date Jul 14, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...
- Publication number 20110133342
- Publication date Jun 9, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
- Publication number 20100112804
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
- Publication number 20100112759
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
- Publication number 20100112802
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
- Publication number 20100025081
- Publication date Feb 4, 2010
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090250803
- Publication date Oct 8, 2009
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE
- Publication number 20090145636
- Publication date Jun 11, 2009
- Shinko Electric Industries Co., Ltd.
- Syota MIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE
- Publication number 20080315413
- Publication date Dec 25, 2008
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT INTEGRATED SUBSTRATE
- Publication number 20080307642
- Publication date Dec 18, 2008
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Kurashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, manufacturing method thereof, and semiconductor d...
- Publication number 20080155820
- Publication date Jul 3, 2008
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080076207
- Publication date Mar 27, 2008
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate having a built-in chip and external connection terminals...
- Publication number 20060087045
- Publication date Apr 27, 2006
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a built-in chip type substrate
- Publication number 20050266609
- Publication date Dec 1, 2005
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tadashi Arai

Person

Patents Grantslast 30 patents

Electronic part embedded substrate and method of producing an elect...

Electronic part embedded substrate and method of producing an elect...

Semiconductor device having multiple magnetic shield members

Semiconductor device having multiple magnetic shield members

Chip embedded substrate and method of producing the same

Wiring substrate, light emitting device, and method for manufacturi...

Light-emitting element mounting package, light-emitting element pac...

Package for mounting electronic components, electronic apparatus, a...

Chip embedded substrate and method of producing the same

Substrate, light emitting device and method for manufacturing subst...

Wiring substrate, method for manufacturing wiring substrate, and se...

Wiring board, manufacturing method of the wiring board, and semicon...

Semiconductor element, semiconductor element mounted board, and met...

Semiconductor device with electronic component incorporation substrate

Wiring substrate, electronic device, and method of manufacturing wi...

Electronic component mounting package

Electronic device manufacturing method and electronic device

Chip embedded substrate and method of producing the same

Manufacturing method for semiconductor device embedded substrate

Manufacturing method for semiconductor device embedded substrate

Semiconductor device and method of manufacturing the same

Manufacturing method for semiconductor device embedded substrate

Wiring substrate, manufacturing method thereof, and semiconductor d...

Method of manufacturing electronic component integrated substrate

Manufacturing method of semiconductor device

Substrate having a built-in chip and external connection terminals...

Method of fabricating a built-in chip type substrate

Patents Applicationslast 30 patents

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...

PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, A...

Substrate, Light Emitting Device and Method for Manufacturing Subst...

WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURI...

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WI...

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND MET...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...

WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE

WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT MOUNTING PACKAGE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

METHOD OF MANUFACTURING ELECTRONIC COMPONENT INTEGRATED SUBSTRATE

Wiring substrate, manufacturing method thereof, and semiconductor d...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Substrate having a built-in chip and external connection terminals...

Method of fabricating a built-in chip type substrate