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Tadashi Arikawa
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Toyama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Heat spreader and method for manufacturing the same
Patent number
10,215,512
Issue date
Feb 26, 2019
A.L.M.T. Corp.
Hiroaki Oki
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Composite material, method for producing same and member using same
Patent number
7,547,412
Issue date
Jun 16, 2009
A.L.M.T. Corporation
Masayuki Itoh
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Method of producing a heat dissipation substrate of molybdenum powd...
Patent number
7,083,759
Issue date
Aug 1, 2006
A.L.M.T. Corp.
Mitsuo Osada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Semiconductor package and method for producing heat-radiating subst...
Patent number
6,926,861
Issue date
Aug 9, 2005
Tokyo Tungsten Co., Ltd.
Norio Hirayama
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor package and method for producing heat-radiating subst...
Patent number
6,693,353
Issue date
Feb 17, 2004
Tokyo Tungsten Co., Ltd.
Norio Hirayama
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
Patent number
6,475,429
Issue date
Nov 5, 2002
Tokyo Tungsten Co., Ltd.
Mitsuo Osada
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
Patent number
6,271,585
Issue date
Aug 7, 2001
Tokyo Tungsten Co., Ltd.
Mitsuo Osada
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Plastic-packaged semiconductor device having a heat sink matched wi...
Patent number
5,493,153
Issue date
Feb 20, 1996
Tokyo Tungsten Co., Ltd.
Tadashi Arikawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HEAT SPREADER AND METHOD FOR MANUFACTURING THE SAME
Publication number
20170198991
Publication date
Jul 13, 2017
A.L.M.T. CORP.
Hiroaki OKI
B32 - LAYERED PRODUCTS
Information
Patent Application
Method of producing a heat dissipation substrate of molybdenum powd...
Publication number
20060246314
Publication date
Nov 2, 2006
A.L.M.T. CORP.
Mitsuo Osada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Composite material, method for producing same and member using same
Publication number
20050287387
Publication date
Dec 29, 2005
Masayuki Itoh
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Semiconductor package and method for producing heat-radiating subst...
Publication number
20040056352
Publication date
Mar 25, 2004
TOKYO TUNGSTEN CO., LTD.
Norio Hirayama
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Material of heat-dissipating plate on which semiconductor is mounte...
Publication number
20020191377
Publication date
Dec 19, 2002
Mitsuo Osada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Heat sink substrate consisting essentially of copper and molybdenum...
Publication number
20020017346
Publication date
Feb 14, 2002
Mitsuo Osada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...