Membership
Tour
Register
Log in
Tadashi Igarashi
Follow
Person
Toyama, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Plastic-packaged semiconductor device having a heat sink matched wi...
Patent number
5,493,153
Issue date
Feb 20, 1996
Tokyo Tungsten Co., Ltd.
Tadashi Arikawa
H01 - BASIC ELECTRIC ELEMENTS