Tadashi Kodaira

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 10,290,570
- Issue date May 14, 2019
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,121,695
- Issue date Nov 6, 2018
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectric composite substrate and method of manufacturing the same
- Patent number 7,873,245
- Issue date Jan 18, 2011
- Shinko Electric Industries Co., Ltd.
- Hideki Yonekura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method
- Patent number 7,807,560
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectric composite substrate and method of manufacturing the same
- Patent number 7,801,396
- Issue date Sep 21, 2010
- Shinko Electric Industries Co., Ltd.
- Hideki Yonekura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for semiconductor devices
- Patent number 7,696,617
- Issue date Apr 13, 2010
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectric composite substrate and method of manufacturing the same
- Patent number 7,340,121
- Issue date Mar 4, 2008
- Shinko Electric Industries Co., Ltd.
- Hideki Yonekura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for semiconductor devices
- Patent number 7,285,856
- Issue date Oct 23, 2007
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 7,196,426
- Issue date Mar 27, 2007
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 7,164,198
- Issue date Jan 16, 2007
- Shinko Electric Industres, Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wiring substrate
- Patent number 7,093,356
- Issue date Aug 22, 2006
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing multilayer circuit board for semiconductor device
- Patent number 6,988,312
- Issue date Jan 24, 2006
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 6,759,739
- Issue date Jul 6, 2004
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20180218972
- Publication date Aug 2, 2018
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180218941
- Publication date Aug 2, 2018
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for semiconductor devices
- Publication number 20100155114
- Publication date Jun 24, 2010
- Shinko Electronics
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for semiconductor devices
- Publication number 20100155933
- Publication date Jun 24, 2010
- Shinko Electronics
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090288870
- Publication date Nov 26, 2009
- Shinko Electric Industries Co., Ltd.
- Hitoshi KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING METHOD
- Publication number 20090023281
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectric composite substrate and method of manufacturing the same
- Publication number 20080251496
- Publication date Oct 16, 2008
- Shinko Electric Industries Co., Ltd.
- Hideki Yonekura
- G02 - OPTICS
Information Patent Application
Optoelectric composite substrate and method of manufacturing the same
- Publication number 20080107375
- Publication date May 8, 2008
- Shinko Electric Industries Co., Ltd.
- Hideki Yonekura
- G02 - OPTICS
Information Patent Application
Package for semiconductor devices
- Publication number 20080042258
- Publication date Feb 21, 2008
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectric composite substrate and method of manufacturing the same
- Publication number 20050190808
- Publication date Sep 1, 2005
- Shinko Electric Industries Co., Ltd.
- Hideki Yonekura
- G02 - OPTICS
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20050087860
- Publication date Apr 28, 2005
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for semiconductor devices
- Publication number 20050006744
- Publication date Jan 13, 2005
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multilayer circuit board for semiconductor...
- Publication number 20040074088
- Publication date Apr 22, 2004
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing wiring substrate
- Publication number 20040060174
- Publication date Apr 1, 2004
- Shinko Electric Industries Co. Ltd
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20040046244
- Publication date Mar 11, 2004
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20030080409
- Publication date May 1, 2003
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tadashi Kodaira

Person

Patents Grantslast 30 patents

Wiring substrate

Semiconductor device

Optoelectric composite substrate and method of manufacturing the same

Solder bump forming method

Optoelectric composite substrate and method of manufacturing the same

Package for semiconductor devices

Optoelectric composite substrate and method of manufacturing the same

Package for semiconductor devices

Multilayered substrate for semiconductor device

Multilayered substrate for semiconductor device

Method for producing wiring substrate

Method for producing multilayer circuit board for semiconductor device

Multilayered substrate for semiconductor device

Patents Applicationslast 30 patents

WIRING SUBSTRATE

SEMICONDUCTOR DEVICE

Package for semiconductor devices

Package for semiconductor devices

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SOLDER BUMP FORMING METHOD

Optoelectric composite substrate and method of manufacturing the same

Optoelectric composite substrate and method of manufacturing the same

Package for semiconductor devices

Optoelectric composite substrate and method of manufacturing the same

Multilayered substrate for semiconductor device

Package for semiconductor devices

Method for manufacturing multilayer circuit board for semiconductor...

Method for producing wiring substrate

Multilayered substrate for semiconductor device

Multilayered substrate for semiconductor device