TADASHI MAEDA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Filtering medium and air purifier
- Patent number 10,168,059
- Issue date Jan 1, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takayoshi Yamaguchi
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Grant
Connection structure of circuit member, connection method, and conn...
- Patent number 9,999,123
- Issue date Jun 12, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting line and electronic component mountin...
- Patent number 9,439,335
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadashi Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting line and electronic component mountin...
- Patent number 9,125,329
- Issue date Sep 1, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadashi Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for soldering and soldering process
- Patent number 8,960,526
- Issue date Feb 24, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting line and electronic component mountin...
- Patent number 8,673,685
- Issue date Mar 18, 2014
- Panasonic Corporation
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste for soldering and soldering method using the same
- Patent number 8,083,121
- Issue date Dec 27, 2011
- Panasonic Corporation
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering electronic component and soldering structure o...
- Patent number 7,632,710
- Issue date Dec 15, 2009
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering electronic component having solder bumps to sub...
- Patent number 7,568,610
- Issue date Aug 4, 2009
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method of manufacturing the device and method...
- Patent number 6,797,544
- Issue date Sep 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bump and method of mounting the same
- Patent number 6,189,771
- Issue date Feb 20, 2001
- Matsushita Electric Industrial Co., Ltd.
- Tadashi Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD
- Publication number 20240282594
- Publication date Aug 22, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tadashi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...
- Publication number 20240196545
- Publication date Jun 13, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki YOSHIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE
- Publication number 20240015893
- Publication date Jan 11, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki MANTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILTERING MEDIUM AND AIR PURIFIER
- Publication number 20170072406
- Publication date Mar 16, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAYOSHI YAMAGUCHI
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
CONNECTION STRUCTURE OF CIRCUIT MEMBER, CONNECTION METHOD, AND CONN...
- Publication number 20160316554
- Publication date Oct 27, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...
- Publication number 20140208587
- Publication date Jul 31, 2014
- PANASONIC CORPORATION
- Tadashi Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...
- Publication number 20140073088
- Publication date Mar 13, 2014
- PANASONIC CORPORATION
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...
- Publication number 20140053398
- Publication date Feb 27, 2014
- Tadashi Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...
- Publication number 20090233117
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux for Soldering and Soldering Process
- Publication number 20080244900
- Publication date Oct 9, 2008
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Paste For Soldering And Soldering Method Using The Same
- Publication number 20080048009
- Publication date Feb 28, 2008
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20070278456
- Publication date Dec 6, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of soldering electronic component having solder bumps to sub...
- Publication number 20050284921
- Publication date Dec 29, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Tadahiko Sakai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device, method of manufacturing the device and mehtod...
- Publication number 20020048906
- Publication date Apr 25, 2002
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS

TADASHI MAEDA

Person

Patents Grantslast 30 patents

Filtering medium and air purifier

Connection structure of circuit member, connection method, and conn...

Electronic component mounting line and electronic component mountin...

Electronic component mounting line and electronic component mountin...

Flux for soldering and soldering process

Electronic component mounting line and electronic component mountin...

Paste for soldering and soldering method using the same

Method for soldering electronic component and soldering structure o...

Method of soldering electronic component having solder bumps to sub...

Semiconductor device, method of manufacturing the device and method...

Method of forming solder bump and method of mounting the same

Patents Applicationslast 30 patents

ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...

MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE

FILTERING MEDIUM AND AIR PURIFIER

CONNECTION STRUCTURE OF CIRCUIT MEMBER, CONNECTION METHOD, AND CONN...

ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...

ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...

ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...

METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...

Flux for Soldering and Soldering Process

Paste For Soldering And Soldering Method Using The Same

SOLDER PASTE

Method of soldering electronic component having solder bumps to sub...

Semiconductor device, method of manufacturing the device and mehtod...