Tadashi Tanaka

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Molded resin articles
- Patent number 6,437,048
- Issue date Aug 20, 2002
- Chisso Corporation
- Jun Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Ceramic circuit board
- Patent number 5,672,848
- Issue date Sep 30, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board with a curved lead terminal
- Patent number 5,328,751
- Issue date Jul 12, 1994
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ceramic circuit board
- Patent number 5,240,551
- Issue date Aug 31, 1993
- Kabushiki Kaisha Toshiba
- Kazuo Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded ceramic metal composite substrate, circuit board constructed...
- Patent number 4,987,677
- Issue date Jan 29, 1991
- Kabushiki Kaisha Toshiba
- Tadashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined metal composite and method for production thereof
- Patent number 4,985,097
- Issue date Jan 15, 1991
- Kabushiki Kaisha Toshiba
- Kazuo Matsumura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Bonded ceramic metal composite substrate, circuit board constructed...
- Patent number 4,959,507
- Issue date Sep 25, 1990
- Kabushiki Kaisha Toshiba
- Tadashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined ceramic-metal composite substrate and method for production...
- Patent number 4,954,386
- Issue date Sep 4, 1990
- Kabushiki Kaisha Toshiba
- Nobuyuki Mizunoya
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Tadashi Tanaka

Person

Patents Grantslast 30 patents

Molded resin articles

Ceramic circuit board

Ceramic circuit board with a curved lead terminal

Method of manufacturing ceramic circuit board

Bonded ceramic metal composite substrate, circuit board constructed...

Joined metal composite and method for production thereof

Bonded ceramic metal composite substrate, circuit board constructed...

Joined ceramic-metal composite substrate and method for production...