Tadato Nagasawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip fabrication method
- Patent number 8,101,504
- Issue date Jan 24, 2012
- Disco Corporation
- Tadato Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing method
- Patent number 7,549,560
- Issue date Jun 23, 2009
- Disco Corporation
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 7,527,547
- Issue date May 5, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Method of dividing wafer into individual devices after forming a re...
- Patent number 7,439,162
- Issue date Oct 21, 2008
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 7,179,724
- Issue date Feb 20, 2007
- Disco Corporation
- Tadato Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP FABRICATION METHOD
- Publication number 20090209088
- Publication date Aug 20, 2009
- Disco Corporation
- Tadato Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing method
- Publication number 20070264912
- Publication date Nov 15, 2007
- DISCO CORPORATION
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Wafer dividing method
- Publication number 20070123002
- Publication date May 31, 2007
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer dividing method
- Publication number 20050259459
- Publication date Nov 24, 2005
- DISCO CORPORATION
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer processing method
- Publication number 20050037541
- Publication date Feb 17, 2005
- Tadato Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS