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Tadato Nagasawa
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip fabrication method
Patent number
8,101,504
Issue date
Jan 24, 2012
Disco Corporation
Tadato Nagasawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer dividing method
Patent number
7,549,560
Issue date
Jun 23, 2009
Disco Corporation
Yusuke Nagai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
7,527,547
Issue date
May 5, 2009
Disco Corporation
Keiichi Kajiyama
B24 - GRINDING POLISHING
Information
Patent Grant
Method of dividing wafer into individual devices after forming a re...
Patent number
7,439,162
Issue date
Oct 21, 2008
Disco Corporation
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer processing method
Patent number
7,179,724
Issue date
Feb 20, 2007
Disco Corporation
Tadato Nagasawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR CHIP FABRICATION METHOD
Publication number
20090209088
Publication date
Aug 20, 2009
Disco Corporation
Tadato Nagasawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer processing method
Publication number
20070264912
Publication date
Nov 15, 2007
DISCO CORPORATION
Keiichi Kajiyama
B24 - GRINDING POLISHING
Information
Patent Application
Wafer dividing method
Publication number
20070123002
Publication date
May 31, 2007
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer dividing method
Publication number
20050259459
Publication date
Nov 24, 2005
DISCO CORPORATION
Yusuke Nagai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wafer processing method
Publication number
20050037541
Publication date
Feb 17, 2005
Tadato Nagasawa
H01 - BASIC ELECTRIC ELEMENTS