Tadatomo Suga

Person

Yamaguchi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Joint structure, electronic device and method for manufacturing the...
- Patent number 11,849,566
- Issue date Dec 19, 2023
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate joining method, substrate joining system and method for c...
- Patent number 11,837,444
- Issue date Dec 5, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 10,204,785
- Issue date Feb 12, 2019
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 10,166,749
- Issue date Jan 1, 2019
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin substrate, method for manufacturing same, and method for trans...
- Patent number 10,043,975
- Issue date Aug 7, 2018
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding polymer film and polymer film, method for bondin...
- Patent number 9,962,908
- Issue date May 8, 2018
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 9,870,922
- Issue date Jan 16, 2018
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 9,601,350
- Issue date Mar 21, 2017
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element sealing method and bonded substrate
- Patent number 9,331,305
- Issue date May 3, 2016
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component bonding method
- Patent number 8,915,418
- Issue date Dec 23, 2014
- Tadatomo Suga
- Toshiyuki Shiratori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Element pressing apparatus and heating system using element pressin...
- Patent number 8,875,977
- Issue date Nov 4, 2014
- Alpha Design Co., Ltd.
- Toshiyuki Shiratori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,091,764
- Issue date Jan 10, 2012
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 7,784,670
- Issue date Aug 31, 2010
- Bondtech Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 7,776,735
- Issue date Aug 17, 2010
- Renesas Technology Corp.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates and method for irradiating particle b...
- Patent number 7,686,912
- Issue date Mar 30, 2010
- Ayumi Industry Co., Ltd.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method and inspection apparatus for inspecting electrica...
- Patent number 7,688,088
- Issue date Mar 30, 2010
- Tokyo Electron Limited
- Shigekazu Komatsu
- G01 - MEASURING TESTING
Information Patent Grant
Device for bonding a metal on a surface of a substrate
- Patent number 7,591,293
- Issue date Sep 22, 2009
- Toray Engineering Co., Ltd.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates and device for bonding substrates
- Patent number 7,550,366
- Issue date Jun 23, 2009
- Ayumi Industry
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus to break the oxide of an electrode by fritting...
- Patent number 7,319,339
- Issue date Jan 15, 2008
- Tokyo Electron Limited
- Shinji Iino
- G01 - MEASURING TESTING
Information Patent Grant
Inspection method and inspection apparatus
- Patent number 7,304,489
- Issue date Dec 4, 2007
- Tokyo Electron Limited
- Shinji Iino
- G01 - MEASURING TESTING
Information Patent Grant
High-reliable semiconductor device using hermetic sealing of electr...
- Patent number 7,301,243
- Issue date Nov 27, 2007
- Sharp Kabushiki Kaisha
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 7,268,430
- Issue date Sep 11, 2007
- Renesas Technology Corp.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method and inspection apparatus for inspecting electrica...
- Patent number 7,262,613
- Issue date Aug 28, 2007
- Tokyo Electron Limited
- Shigekazu Komatsu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method for fabricating the device
- Patent number 7,217,631
- Issue date May 15, 2007
- Sharp Kabushiki Kaisha
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method therefor
- Patent number 7,183,190
- Issue date Feb 27, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting an electronic part
- Patent number 7,100,279
- Issue date Sep 5, 2006
- Shinko Electric Industries Co., Ltd.
- Tadatomo Suga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the device
- Patent number 7,078,811
- Issue date Jul 18, 2006
- Sharp Kabushiki Kaisha
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method and inspection apparatus
- Patent number 7,061,259
- Issue date Jun 13, 2006
- Tokyo Electron Limited
- Shinji Iino
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079373
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079374
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDER, AND BONDING SYSTEM
- Publication number 20240066624
- Publication date Feb 29, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM
- Publication number 20240009984
- Publication date Jan 11, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR C...
- Publication number 20230136771
- Publication date May 4, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20220142005
- Publication date May 5, 2022
- DENSO CORPORATION
- TOSHIHIRO MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20210265300
- Publication date Aug 26, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20180068854
- Publication date Mar 8, 2018
- BONDTECH CO., LTD.
- Tadatomo SUGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR TRANS...
- Publication number 20170200891
- Publication date Jul 13, 2017
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20170047225
- Publication date Feb 16, 2017
- BONDTECH CO., LTD.
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT SEALING METHOD AND BONDED SUBSTRATE
- Publication number 20150171365
- Publication date Jun 18, 2015
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDIN...
- Publication number 20150104656
- Publication date Apr 16, 2015
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELEMENT PRESSING APPARATUS AND HEATING SYSTEM USING ELEMENT PRESSIN...
- Publication number 20140263575
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140048805
- Publication date Feb 20, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140037945
- Publication date Feb 6, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20100252615
- Publication date Oct 7, 2010
- Bondtech, Inc
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20080254610
- Publication date Oct 16, 2008
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining Method and Device Produced by this Method and Joining Unit
- Publication number 20080245843
- Publication date Oct 9, 2008
- BONDTECH INC.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inspection method and inspection apparatus for inspecting electrica...
- Publication number 20080174325
- Publication date Jul 24, 2008
- TOKYO ELECTRON LIMITED
- Shigekazu Komatsu
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION METHOD AND INSPECTION APPARATUS
- Publication number 20070229101
- Publication date Oct 4, 2007
- Shinji Iino
- G01 - MEASURING TESTING
Information Patent Application
Method for bonding substrates and device for bonding substrates
- Publication number 20070128825
- Publication date Jun 7, 2007
- TADATOMO SUGA
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inspection method and inspection apparatus for inspecting electrica...
- Publication number 20070063725
- Publication date Mar 22, 2007
- TOKYO ELECTRON LIMITED
- Shigekazu Komatsu
- G01 - MEASURING TESTING
Information Patent Application
Inspection method and inspection apparatus
- Publication number 20060192578
- Publication date Aug 31, 2006
- TOKYO ELECTON LIMITED
- Shinji Iino
- G01 - MEASURING TESTING
Information Patent Application
Inspection method and inspection apparatus for inspecting electrica...
- Publication number 20060145716
- Publication date Jul 6, 2006
- Shigekazu Komatsu
- G01 - MEASURING TESTING
Information Patent Application
Bonding device and method
- Publication number 20060085965
- Publication date Apr 27, 2006
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-reliable semiconductor device using hermetic sealing of electr...
- Publication number 20060043604
- Publication date Mar 2, 2006
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20060043552
- Publication date Mar 2, 2006
- RENESAS TECHNOLOGY CORP.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS

Tadatomo Suga

Person

Patents Grantslast 30 patents

Joint structure, electronic device and method for manufacturing the...

Substrate joining method, substrate joining system and method for c...

Substrate bonding apparatus and substrate bonding method

Bonding-substrate fabrication method, bonding substrate, substrate...

Thin substrate, method for manufacturing same, and method for trans...

Method for bonding polymer film and polymer film, method for bondin...

Substrate bonding apparatus and substrate bonding method

Bonding-substrate fabrication method, bonding substrate, substrate...

Electronic element sealing method and bonded substrate

Chip-on-wafer bonding method and bonding device, and structure comp...

Electronic component bonding method

Element pressing apparatus and heating system using element pressin...

Joining method and device produced by this method and joining unit

Joining method and device produced by this method and joining unit

Joining method and device produced by this method and joining unit

Semiconductor device and process for manufacturing the same

Method for bonding substrates and method for irradiating particle b...

Inspection method and inspection apparatus for inspecting electrica...

Device for bonding a metal on a surface of a substrate

Method for bonding substrates and device for bonding substrates

Inspection apparatus to break the oxide of an electrode by fritting...

Inspection method and inspection apparatus

High-reliable semiconductor device using hermetic sealing of electr...

Semiconductor device and process for manufacturing the same

Inspection method and inspection apparatus for inspecting electrica...

Semiconductor device and method for fabricating the device

Semiconductor device and fabrication method therefor

Method of mounting an electronic part

Semiconductor device and method for fabricating the device

Inspection method and inspection apparatus

Patents Applicationslast 30 patents

BONDING SYSTEM AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

BONDING METHOD, BONDER, AND BONDING SYSTEM

SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM

SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR C...

JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...

BONDING SYSTEM AND BONDING METHOD

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

THIN SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR TRANS...

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

ELECTRONIC ELEMENT SEALING METHOD AND BONDED SUBSTRATE

METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDIN...

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

ELEMENT PRESSING APPARATUS AND HEATING SYSTEM USING ELEMENT PRESSIN...

ELECTRONIC COMPONENT BONDING METHOD

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

Semiconductor device and process for manufacturing the same

Joining Method and Device Produced by this Method and Joining Unit

Inspection method and inspection apparatus for inspecting electrica...

INSPECTION METHOD AND INSPECTION APPARATUS

Method for bonding substrates and device for bonding substrates

Inspection method and inspection apparatus for inspecting electrica...

Inspection method and inspection apparatus

Inspection method and inspection apparatus for inspecting electrica...

Bonding device and method

High-reliable semiconductor device using hermetic sealing of electr...

Semiconductor device and process for manufacturing the same