Tae Hong HA

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selective deposition
- Patent number 12,157,943
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of metal films with tungsten liner
- Patent number 11,948,836
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for precleaning and treating wafer surfaces
- Patent number 11,939,666
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line
- Patent number 11,784,127
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line applications
- Patent number 11,764,157
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binary metal liner layers
- Patent number 11,587,873
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Gang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional selective junction clean with field polymer protections
- Patent number 11,562,909
- Issue date Jan 24, 2023
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for intermixing layer for enhanced metal reflow
- Patent number 11,527,437
- Issue date Dec 13, 2022
- Applied Materials, Inc.
- Lanlan Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for controlling contact resistance in cobalt-...
- Patent number 11,424,132
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Takashi Kuratomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for selective deposition of tungsten atop a dielectric laye...
- Patent number 11,417,568
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Wei Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impurity removal in doped ALD tantalum nitride
- Patent number 11,410,881
- Issue date Aug 9, 2022
- Applied Materials, Inc.
- Rui Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Doping of metal barrier layers
- Patent number 11,270,911
- Issue date Mar 8, 2022
- Applied Materials Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of metal films with tungsten liner
- Patent number 11,171,045
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming cobalt and ruthenium capping layers for interco...
- Patent number 11,171,046
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ALD copper with high temperature PVD copper depositi...
- Patent number 10,892,186
- Issue date Jan 12, 2021
- Applied Materials, Inc.
- Ben-Li Sheu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for depositing cobalt in a feature
- Patent number 10,714,388
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Jin Hee Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for depositing cobalt in a feature
- Patent number 10,157,787
- Issue date Dec 18, 2018
- Applied Materials, Inc.
- Jin Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming cobalt-copper selective fill for an interconnect
- Patent number 10,014,179
- Issue date Jul 3, 2018
- Applied Materials, Inc.
- Rong Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for protecting metal interconnect from halogen...
- Patent number 10,002,834
- Issue date Jun 19, 2018
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to deposit CVD ruthenium
- Patent number 9,938,622
- Issue date Apr 10, 2018
- Applied Materials, Inc.
- Tae Hong Ha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming a cobalt-ruthenium liner layer for interconnect...
- Patent number 9,677,172
- Issue date Jun 13, 2017
- Applied Materials, Inc.
- Tae Hong Ha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming layers on substrates
- Patent number 8,476,162
- Issue date Jul 2, 2013
- Applied Materials, Inc.
- Tae Hong Ha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES
- Publication number 20240183028
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Xiangjin XIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20240038859
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
- Publication number 20220344275
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS
- Publication number 20220336223
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-TITANIUM STRUC...
- Publication number 20220336227
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- TAKASHI KURATOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Impurity Removal in Doped ALD Tantalum Nitride
- Publication number 20220328348
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Rui Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20220231137
- Publication date Jul 21, 2022
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTERMIXING LAYER FOR ENHANCED METAL REFLOW
- Publication number 20220084882
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Lanlan ZHONG
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF SELECTIVE DEPOSITION
- Publication number 20220064784
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FORMING STABILIZATION LAYERS
- Publication number 20220037204
- Publication date Feb 3, 2022
- Applied Materials, Inc.
- Wenjing XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
- Publication number 20220028795
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF METAL FILMS WITH TUNGSTEN LINER
- Publication number 20220028793
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impurity Removal in Doped ALD Tantalum Nitride
- Publication number 20210407853
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Rui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES
- Publication number 20210371972
- Publication date Dec 2, 2021
- Applied Materials, Inc.
- Xiangjin XIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS
- Publication number 20210366722
- Publication date Nov 25, 2021
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF METAL BARRIER LAYERS
- Publication number 20210351072
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Binary Metal Liner Layers
- Publication number 20210351136
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Gang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE DEPOSITION OF TUNGSTEN ATOP A DIELECTRIC LAYE...
- Publication number 20210320034
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Wei LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COBALT AND RUTHENIUM CAPPING LAYERS FOR INTERCO...
- Publication number 20200321247
- Publication date Oct 8, 2020
- Applied Materials, Inc.
- FENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-...
- Publication number 20200144073
- Publication date May 7, 2020
- Applied Materials, Inc.
- TAKASHI KURATOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING A COBALT LAYER ON A SUBSTRATE
- Publication number 20200144056
- Publication date May 7, 2020
- Applied Materials, Inc.
- WEI LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...
- Publication number 20190348369
- Publication date Nov 14, 2019
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Of Metal Films
- Publication number 20190341302
- Publication date Nov 7, 2019
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE
- Publication number 20190122924
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Jin Hee PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration Of ALD Copper With High Temperature PVD Copper Depositi...
- Publication number 20190115254
- Publication date Apr 18, 2019
- Applied Materials, Inc.
- Ben-Li Sheu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE
- Publication number 20170178956
- Publication date Jun 22, 2017
- Applied Materials, Inc.
- Jin Hee PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...
- Publication number 20160268207
- Publication date Sep 15, 2016
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COBALT-COPPER SELECTIVE FILL FOR AN INTERCONNECT
- Publication number 20160240432
- Publication date Aug 18, 2016
- Applied Materials, Inc.
- RONG TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO DEPOSIT CVD RUTHENIUM
- Publication number 20160160350
- Publication date Jun 9, 2016
- Applied Materials, Inc.
- Tae Hong HA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING A COBALT-RUTHENIUM LINER LAYER FOR INTERCONNECT...
- Publication number 20150203961
- Publication date Jul 23, 2015
- Applied Materials, Inc.
- TAE HONG HA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tae Hong HA

Person

Patents Grantslast 30 patents

Method of forming a metal liner for interconnect structures

Methods of selective deposition

Deposition of metal films with tungsten liner

Methods and apparatus for precleaning and treating wafer surfaces

Ruthenium liner and cap for back-end-of-line

Ruthenium liner and cap for back-end-of-line applications

Binary metal liner layers

Directional selective junction clean with field polymer protections

Methods and apparatus for intermixing layer for enhanced metal reflow

Methods and apparatus for controlling contact resistance in cobalt-...

Methods for selective deposition of tungsten atop a dielectric laye...

Impurity removal in doped ALD tantalum nitride

Doping of metal barrier layers

Deposition of metal films with tungsten liner

Methods for forming cobalt and ruthenium capping layers for interco...

Integration of ALD copper with high temperature PVD copper depositi...

Method and apparatus for depositing cobalt in a feature

Method and apparatus for depositing cobalt in a feature

Methods for forming cobalt-copper selective fill for an interconnect

Method and apparatus for protecting metal interconnect from halogen...

Method to deposit CVD ruthenium

Methods for forming a cobalt-ruthenium liner layer for interconnect...

Methods of forming layers on substrates

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES

METAL CAP FOR CONTACT RESISTANCE REDUCTION

RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS

DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS

METHODS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-TITANIUM STRUC...

Impurity Removal in Doped ALD Tantalum Nitride

METAL CAP FOR CONTACT RESISTANCE REDUCTION

METHODS AND APPARATUS FOR INTERMIXING LAYER FOR ENHANCED METAL REFLOW

METHODS OF SELECTIVE DEPOSITION

METHODS AND APPARATUS FOR FORMING STABILIZATION LAYERS

RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS

DEPOSITION OF METAL FILMS WITH TUNGSTEN LINER

Impurity Removal in Doped ALD Tantalum Nitride

METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES

DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS

DOPING OF METAL BARRIER LAYERS

Binary Metal Liner Layers

METHODS FOR SELECTIVE DEPOSITION OF TUNGSTEN ATOP A DIELECTRIC LAYE...

METHODS FOR FORMING COBALT AND RUTHENIUM CAPPING LAYERS FOR INTERCO...

METHODS AND APPARATUS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-...

METHOD OF FORMING A COBALT LAYER ON A SUBSTRATE

METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...

Deposition Of Metal Films

METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE

Integration Of ALD Copper With High Temperature PVD Copper Depositi...

METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE

METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...

METHODS FOR FORMING COBALT-COPPER SELECTIVE FILL FOR AN INTERCONNECT

METHOD TO DEPOSIT CVD RUTHENIUM

METHODS FOR FORMING A COBALT-RUTHENIUM LINER LAYER FOR INTERCONNECT...