Tae-Sik Eo

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Seongnam, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for interconnecting multi-layer printed circuit board
- Patent number 7,320,173
- Issue date Jan 22, 2008
- LG Electronics Inc.
- Sung-Gue Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and fabricating method thereof
- Patent number 7,189,302
- Issue date Mar 13, 2007
- LG Electronics Inc.
- Jung-Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer printed circuit board and fabricating method thereof
- Publication number 20050098347
- Publication date May 12, 2005
- LG Electronics Inc.
- Jung-Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for interconnecting multi-layer printed circuit board
- Publication number 20040154162
- Publication date Aug 12, 2004
- LG Electronics Inc.
- Sung-Gue Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR