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Ichon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked integrated circuit and package system and method for manufa...
Patent number
8,102,043
Issue date
Jan 24, 2012
Stats Chippac Ltd.
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with planar interconnects
Patent number
8,067,831
Issue date
Nov 29, 2011
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit and package system
Patent number
7,875,966
Issue date
Jan 25, 2011
Stats Chippac Ltd.
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Synchronous signal detection circuit and method
Patent number
6,369,856
Issue date
Apr 9, 2002
Hyundai DisplayTechnology Inc.
Tae Bo Jeong
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
STACKED INTEGRATED CIRCUIT AND PACKAGE SYSTEM AND METHOD FOR MANUFA...
Publication number
20110108976
Publication date
May 12, 2011
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP PACKAGE SYSTEM
Publication number
20070241441
Publication date
Oct 18, 2007
STATS ChipPAC Ltd.
Sungwon Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked integrated circuit and package system
Publication number
20060180911
Publication date
Aug 17, 2006
STATS ChipPAC Ltd.
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS