Taeeun Kim

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices including conductive vias, conductive caps...
- Patent number 8,399,987
- Issue date Mar 19, 2013
- Samsung Electronics Co., Ltd.
- Woonseong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20170162555
- Publication date Jun 8, 2017
- Junglae Jo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES
- Publication number 20130126219
- Publication date May 23, 2013
- Samsung Electronics Co., Ltd.
- Pyoungwan Kim
- B32 - LAYERED PRODUCTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS...
- Publication number 20110133333
- Publication date Jun 9, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Woonseong Kwon
- H01 - BASIC ELECTRIC ELEMENTS