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Taeg Ki Lim
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Icheon, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package system with support carrier and method o...
Patent number
8,987,056
Issue date
Mar 24, 2015
Stats Chippac Ltd.
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with offset stack
Patent number
8,659,175
Issue date
Feb 25, 2014
Stats Chippac Ltd.
Jong Wook Ju
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with wafer scale heat slug
Patent number
8,618,653
Issue date
Dec 31, 2013
Stats Chippac Ltd.
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system including honeycomb molding
Patent number
8,409,921
Issue date
Apr 2, 2013
Stats Chippac Ltd.
Heap Hoe Kuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system including honeycomb molding
Patent number
8,217,501
Issue date
Jul 10, 2012
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with package integration
Patent number
8,067,275
Issue date
Nov 29, 2011
Stats Chippac Ltd.
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with planar interconnects
Patent number
8,067,831
Issue date
Nov 29, 2011
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with triple film spacer having em...
Patent number
7,969,023
Issue date
Jun 28, 2011
Stats Chippac Ltd.
Taeg Ki Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system including honeycomb molding
Patent number
7,737,539
Issue date
Jun 15, 2010
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with thermo-mechanical interlocki...
Patent number
7,656,017
Issue date
Feb 2, 2010
Stats Chippac Ltd.
Hyun Joung Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked integrated circuit package system with connection protection
Patent number
7,443,037
Issue date
Oct 28, 2008
Stats Chippac Ltd.
Hyun Joung Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
Publication number
20100279504
Publication date
Nov 4, 2010
Heap Hoe Kuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
Publication number
20100237488
Publication date
Sep 23, 2010
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT CARRIER AND METHOD O...
Publication number
20100123242
Publication date
May 20, 2010
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM FOR HANDLING SEMICONDUCTOR DIES
Publication number
20090191029
Publication date
Jul 30, 2009
Taeg Ki Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG
Publication number
20090189275
Publication date
Jul 30, 2009
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION
Publication number
20090155961
Publication date
Jun 18, 2009
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER
Publication number
20090020893
Publication date
Jan 22, 2009
Taeg Ki Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THERMO-MECHANICAL INTERLOCKI...
Publication number
20080142943
Publication date
Jun 19, 2008
Hyun Joung Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACK
Publication number
20070296086
Publication date
Dec 27, 2007
Jong Wook Ju
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONNECTION PROTECTION
Publication number
20070229107
Publication date
Oct 4, 2007
STATS ChipPAC Ltd.
Hyun Joung Kim
H01 - BASIC ELECTRIC ELEMENTS