TaegKi Lim

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Kyounggi, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming protective material between semiconductor die sta...
- Patent number 9,136,144
- Issue date Sep 15, 2015
- STATS ChipPAC, Ltd.
- TaegKi Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Protective Material Betw...
- Publication number 20110115070
- Publication date May 19, 2011
- STATS ChipPAC, Ltd.
- TaegKi Lim
- H01 - BASIC ELECTRIC ELEMENTS