Taeho Kim

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Seoul-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with heat dissipation enclosure
- Patent number 7,521,780
- Issue date Apr 21, 2009
- Stats Chippac Ltd.
- Taeho Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit package system with heat dissipation enclosure
- Publication number 20070108597
- Publication date May 17, 2007
- Taeho Kim
- H01 - BASIC ELECTRIC ELEMENTS