TAEJOO HWANG

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Gyeonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having package-on-package structures
- Patent number 10,141,289
- Issue date Nov 27, 2018
- Samsung Electronics Co., Ltd.
- Taejoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wiring board, semiconductor package including the same and...
- Patent number 8,039,939
- Issue date Oct 18, 2011
- Samsung Electronics Co., Ltd.
- Taejoo Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250038112
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Taejoo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having Package-On-Package Structures
- Publication number 20160322338
- Publication date Nov 3, 2016
- TAEJOO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20150155268
- Publication date Jun 4, 2015
- TAEJOO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140327156
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- Taejoo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING PACKAGE-ON-PACKAGE STRUCTURES
- Publication number 20140291830
- Publication date Oct 2, 2014
- TAEJOO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED WIRING BOARD, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND...
- Publication number 20090321921
- Publication date Dec 31, 2009
- TAEJOO HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR