Taejoo Hwang

Follow

Person

Troy, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
Wafer bonding compatible with bulk micro-machining
- Publication number 20070072330
- Publication date Mar 29, 2007
- Rensselaer Polytechnic Institute
- Dan O. Popa
- B81 - MICRO-STRUCTURAL TECHNOLOGY