Taek K. Kim

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Leadless power amplifier packages including topside termination int...
- Patent number 11,984,429
- Issue date May 14, 2024
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a semiconductor component and apparatus therefor
- Patent number 7,101,736
- Issue date Sep 5, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...
- Publication number 20230115340
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS