Membership
Tour
Register
Log in
Taek-keun Lee
Follow
Person
Bucheon-si, KR
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Power device package comprising metal tab die attach paddle (DAP) a...
Patent number
8,945,992
Issue date
Feb 3, 2015
Fairchild Korea Semiconductor, Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High power semiconductor package
Patent number
8,350,369
Issue date
Jan 8, 2013
Fairchild Korea Semiconductor, Ltd.
Keun-hyuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device package comprising metal tab die attach paddle (DAP) a...
Patent number
8,067,826
Issue date
Nov 29, 2011
Fairchild Korea Semiconductor Ltd
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20130307145
Publication date
Nov 21, 2013
FAIRCHILD KOREA SEMICONDUCTOR LTD.
Yoon-jae CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) A...
Publication number
20120034741
Publication date
Feb 9, 2012
Fairchild Korea Semiconductor Co., Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) A...
Publication number
20080164589
Publication date
Jul 10, 2008
Fairchild Korea Semiconductor, Ltd.
Joon-seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH POWER SEMICONDUCTOR PACKAGE
Publication number
20080164588
Publication date
Jul 10, 2008
Fairchild Korea Semiconductor, Ltd.
Keun-hyuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Discrete package having insulated ceramic heat sink
Publication number
20040061206
Publication date
Apr 1, 2004
Joon-Seo Son
H01 - BASIC ELECTRIC ELEMENTS