Taekeun Lee

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Ichon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Plastic ball grid array package with integral heatsink
- Patent number 8,030,756
- Issue date Oct 4, 2011
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing plastic ball grid array package with integ...
- Patent number 7,217,598
- Issue date May 15, 2007
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing plastic ball grid array with integral heat...
- Patent number 6,967,126
- Issue date Nov 22, 2005
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic ball grid array package with integral heatsink
- Patent number 6,614,123
- Issue date Sep 2, 2003
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Plastic Ball Grid Array Package with Integral Heatsink
- Publication number 20070176289
- Publication date Aug 2, 2007
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing plastic ball grid array package with integ...
- Publication number 20060019429
- Publication date Jan 26, 2006
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic ball grid array with integral heatsink
- Publication number 20040043539
- Publication date Mar 4, 2004
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic ball grid array package with integral heatsink
- Publication number 20030025215
- Publication date Feb 6, 2003
- ChipPAC, Inc.
- Taekeun Lee
- H01 - BASIC ELECTRIC ELEMENTS