TaeKeun LEE

Person

Kyoung-gi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Die-beam alignment for laser-assisted bonding
- Patent number 11,929,334
- Issue date Mar 12, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with windowed heat spreader
- Patent number 11,830,785
- Issue date Nov 28, 2023
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 11,735,489
- Issue date Aug 22, 2023
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filp chip interconnection structure with bump on partial pad and me...
- Patent number 9,125,332
- Issue date Sep 1, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Standoff height improvement for bumping technology using solder resist
- Patent number 7,875,495
- Issue date Jan 25, 2011
- STATS ChipPAC, Ltd.
- TaeWoo Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip interconnection structure with bump on partial pad and me...
- Patent number 7,759,137
- Issue date Jul 20, 2010
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Standoff height improvement for bumping technology using solder resist
- Patent number 7,615,865
- Issue date Nov 10, 2009
- STATS ChipPAC, Ltd.
- TaeWoo Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Die-Beam Alignment for Laser-Assisted Bonding
- Publication number 20240170422
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Package with Double-Side...
- Publication number 20240063196
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid TIM Layers
- Publication number 20230352359
- Publication date Nov 2, 2023
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Windowed Heat Spreader
- Publication number 20230118190
- Publication date Apr 20, 2023
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid TIM Layers
- Publication number 20220406675
- Publication date Dec 22, 2022
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Beam Alignment for Laser-Assisted Bonding
- Publication number 20210296268
- Publication date Sep 23, 2021
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filp Chip Interconnection Structure with Bump on Partial Pad and Me...
- Publication number 20100244245
- Publication date Sep 30, 2010
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoff Height Improvement for Bumping Technology Using Solder Resist
- Publication number 20100022050
- Publication date Jan 28, 2010
- STATS ChipPAC, Ltd.
- TaeWoo KANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip Chip Interconnection Structure with Bump on Partial Pad and Me...
- Publication number 20090243080
- Publication date Oct 1, 2009
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoff Height Improvement for Bumping Technology Using Solder Resist
- Publication number 20080293232
- Publication date Nov 27, 2008
- STATS ChipPAC, Ltd.
- TaeWoo KANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

TaeKeun LEE

Person

Patents Grantslast 30 patents

Die-beam alignment for laser-assisted bonding

Package with windowed heat spreader

Semiconductor device and method of forming hybrid TIM layers

Filp chip interconnection structure with bump on partial pad and me...

Standoff height improvement for bumping technology using solder resist

Flip chip interconnection structure with bump on partial pad and me...

Standoff height improvement for bumping technology using solder resist

Patents Applicationslast 30 patents

Die-Beam Alignment for Laser-Assisted Bonding

Semiconductor Device and Method of Forming Package with Double-Side...

Semiconductor Device and Method of Forming Hybrid TIM Layers

Package with Windowed Heat Spreader

Semiconductor Device and Method of Forming Hybrid TIM Layers

Die-Beam Alignment for Laser-Assisted Bonding

Filp Chip Interconnection Structure with Bump on Partial Pad and Me...

Standoff Height Improvement for Bumping Technology Using Solder Resist

Flip Chip Interconnection Structure with Bump on Partial Pad and Me...

Standoff Height Improvement for Bumping Technology Using Solder Resist