Taeseung Kim

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 12,131,909
- Issue date Oct 29, 2024
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 11,823,909
- Issue date Nov 21, 2023
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 10,749,103
- Issue date Aug 18, 2020
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching of tantalum
- Patent number 10,566,213
- Issue date Feb 18, 2020
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 10,515,816
- Issue date Dec 24, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 10,374,144
- Issue date Aug 6, 2019
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 10,186,426
- Issue date Jan 22, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wet metal seed deposition for bottom up gapfill of feat...
- Patent number 10,103,056
- Issue date Oct 16, 2018
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten and other metals
- Patent number 10,096,487
- Issue date Oct 9, 2018
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for enhanced bottom-up feature fill
- Patent number 9,837,312
- Issue date Dec 5, 2017
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 9,806,252
- Issue date Oct 31, 2017
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 9,805,941
- Issue date Oct 31, 2017
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 9,576,811
- Issue date Feb 21, 2017
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20250014904
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20240038539
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20210098257
- Publication date Apr 1, 2021
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20200161139
- Publication date May 21, 2020
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20190312194
- Publication date Oct 10, 2019
- LAM RESEARCH CORPORATION
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20190139778
- Publication date May 9, 2019
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TANTALUM
- Publication number 20180350624
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WET METAL SEED DEPOSITION FOR BOTTOM UP GAPFILL OF FEAT...
- Publication number 20180261502
- Publication date Sep 13, 2018
- LAM RESEARCH CORPORATION
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20180033635
- Publication date Feb 1, 2018
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20180019387
- Publication date Jan 18, 2018
- LAM RESEARCH CORPORATION
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20170117159
- Publication date Apr 27, 2017
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS
- Publication number 20170053810
- Publication date Feb 23, 2017
- LAM RESEARCH CORPORATION
- Wenbing Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20160308112
- Publication date Oct 20, 2016
- LAM RESEARCH CORPORATION
- Samantha Tan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20160203995
- Publication date Jul 14, 2016
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS

Taeseung Kim

Person

Patents Grantslast 30 patents

Selective processing with etch residue-based inhibitors

Selective processing with etch residue-based inhibitors

Dry plasma etch method to pattern MRAM stack

Atomic layer etching of tantalum

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Methods for wet metal seed deposition for bottom up gapfill of feat...

Atomic layer etching of tungsten and other metals

Atomic layer etching for enhanced bottom-up feature fill

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Patents Applicationslast 30 patents

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

ATOMIC LAYER ETCHING OF TANTALUM

METHODS FOR WET METAL SEED DEPOSITION FOR BOTTOM UP GAPFILL OF FEAT...

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...