Taewon YOO

Person

  • Suwon-si, KR

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20250105100
    • Publication date Mar 27, 2025
    • Samsung Electronics Co., Ltd.
    • Hyeonjeong Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

    • Publication number 20230105942
    • Publication date Apr 6, 2023
    • Samsung Electronics Co., Ltd.
    • Hyeonjeong Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230101149
    • Publication date Mar 30, 2023
    • Samsung Electronics Co., Ltd.
    • TAEWON YOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230033087
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Kyoung Lim SUK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220375829
    • Publication date Nov 24, 2022
    • Samsung Electronics Co., Ltd.
    • Hyeonjeong Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE

    • Publication number 20220285328
    • Publication date Sep 8, 2022
    • Samsung Electronics Co., Ltd.
    • DONGKYU KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20220230977
    • Publication date Jul 21, 2022
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220216190
    • Publication date Jul 7, 2022
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220037295
    • Publication date Feb 3, 2022
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20220020653
    • Publication date Jan 20, 2022
    • Samsung Electronics Co., Ltd.
    • Younglyong KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20210257325
    • Publication date Aug 19, 2021
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210202423
    • Publication date Jul 1, 2021
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDISTRIBUTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    • Publication number 20210167007
    • Publication date Jun 3, 2021
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210066148
    • Publication date Mar 4, 2021
    • Samsung Electronics Co., Ltd.
    • Younglyong KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING HEAT REDISTRIBUTION LAYERS

    • Publication number 20200373216
    • Publication date Nov 26, 2020
    • Samsung Electronics Co., Ltd.
    • Taewon YOO
    • H01 - BASIC ELECTRIC ELEMENTS